Surface Mountable Microphone Package with Opposite Acoustic Openings

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Solution Overview

Problem

Conventional smartphones require two separate microphones placed on different sides of the circuit board for recording use and noise sounds, increasing manufacturing complexity and footprint.

Innovation Solution

A surface mountable microphone package with two microphones, one on each side, allowing for the recording of both use and noise sounds within a single package, with fluidic connections for each microphone and a signal processing unit to derive a noise-free output signal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If two separate microphones are placed on different sides of the circuit board, then speech recording and noise recording functions are achieved, but manufacturing complexity and device footprint increase

Engineering Contradiction:

Improvemanufacturing complexityVSAvoidmicrophone package structure

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent combines two separate microphone packages into a single integrated microphone package. The first microphone (for speech) and second microphone (for noise) are housed together in one package with openings on opposite sides, allowing both microphones to be mounted on a single circuit board location rather than requiring two separate mounting locations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated microphone package serves multiple functions simultaneously - it captures both speech sounds and noise sounds through its dual-opening structure, enabling the device to perform both speech recording and noise recording functions from a single component location on the circuit board.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If two separate microphones are placed on different sides of the circuit board, then speech and noise sounds can be recorded, but the area occupied on the circuit board increases

Engineering Contradiction:

Improvecircuit board space utilizationVSAvoidmicrophone package footprint

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The patent merges two separate microphone packages into one integrated package, reducing the total footprint on the circuit board. By placing both microphones in a single package with openings on opposite sides, the design occupies only one location on the circuit board instead of requiring two separate locations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes the third dimension (depth/vertical arrangement) by creating a package structure where openings are positioned on opposite sides of the package body. This three-dimensional arrangement allows both microphones to be accessed from different directions while occupying a compact footprint on the circuit board surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Simplifies manufacturing by integrating two microphones into one package, reducing footprint and enabling effective noise filtration, resulting in a miniaturized semiconductor microphone solution.

Implementation Method 1

The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package

Methodology Applied

Scientific EffectFluidic connection:

Data Source

PatentUS9332330B2Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals

Publication Date: 2016.05.03 INFINEON TECHNOLOGIES AG

AI summary

A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.