Surface Mountable Microphone Package with Opposite Side Acoustic Ports

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Solution Overview

Problem

Conventional smartphones require two separate microphones placed on different sides of the circuit board to record speech and noise sounds, leading to increased complexity and size due to the need for two distinct microphone packages.

Innovation Solution

A surface mountable microphone package with two microphones, one on each side, sharing a common circuit board with a single hole fluidically connected to the second microphone's opening, allowing for the recording of both speech and noise sounds within a single package, reducing footprint and assembly complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If two separate microphones are placed on different sides of the circuit board to record speech and noise sounds, then the recording function is achieved, but the device complexity and size increase

Engineering Contradiction:
Improverecording functionVSAvoidmicrophone package complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines two separate microphone packages into a single integrated surface mountable microphone package. The first microphone (for speech) and second microphone (for noise) are housed together in one package with a single footprint on the circuit board, reducing assembly complexity while maintaining the dual-microphone recording function.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single surface mountable microphone package serves multiple functions: it contains both the speech recording microphone and the noise recording microphone, and provides a unified mounting interface on the circuit board. This multi-functional design eliminates the need for two separate microphone packages.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If two separate microphones are placed on different sides of the circuit board, then speech and noise recording is enabled, but the area occupied increases

Engineering Contradiction:
Improvespeech and noise recording capabilityVSAvoidcircuit board area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges two separate microphone packages into one integrated package that occupies a single footprint area on the circuit board. The first and second microphones are positioned on opposite sides of the package, but the entire assembly mounts in one location, significantly reducing the area required on the circuit board.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If two different microphones are assembled on two different sides of the circuit board, then speech and noise recording functions are achieved, but the manufacturing cost and assembly complexity increase

Engineering Contradiction:
Improvespeech and noise recording functionVSAvoidassembly process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines two separate microphone assemblies into a single surface mountable package that can be mounted in one location on the circuit board. This reduces the assembly process from placing two separate components to placing one integrated component, simplifying manufacturing and reducing labor costs.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient recording of both speech and noise sounds in a compact form factor, reducing production costs and miniaturizing the microphone arrangement while maintaining effective noise filtering.

Implementation Method 1

The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package

Methodology Applied
Scientific EffectFluidic connection:

Implementation Method 2

The circuit board comprises a hole which is arranged adjacent to the second opening of the surface mountable microphone package such that the hole and the second opening are fluidically connected

Methodology Applied
Scientific EffectFluidic connection:

Data Source

PatentUS9998812B2Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals
Publication Date: 2018.06.12 INFINEON TECHNOLOGIES AG
  • US9998812B2 patent drawing
  • US9998812B2 patent drawing
  • US9998812B2 patent drawing

AI summary

A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.