Microphone Package Simplified Wiring Structure
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Solution Overview
Problem
The existing microphone designs with separate cover and substrate members for mounting the microphone chip and signal input/output units result in complex package structures and high manufacturing costs due to intricate wiring and increased package size, which complicates the wire bonding process and increases the risk of contamination and sticking issues.
Innovation Solution
A semiconductor device package structure is simplified by using a first member with a recess for mounting the semiconductor element and a second member for signal input/output, where the connection unit is outside the mounting surface, allowing for easier electrical connection between the members, reducing the need for complex wiring and minimizing the package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the microphone chip is mounted on the cover to cover the acoustic hole, then the sensitivity of the microphone is improved, but the wiring structure becomes complex and the package size increases
Solution Approach 1:
The patent combines the cover and substrate into a single integrated substrate structure. The acoustic hole is formed in the substrate, and the microphone chip is mounted directly on the substrate to cover the acoustic hole, eliminating the need for separate cover wiring and reducing package complexity while maintaining sensitivity
Solution Approach 2:
The substrate is segmented into functional regions: a mounting surface for the microphone chip, a rear surface with bonding pads for electrical connection, and an acoustic hole region. This segmentation allows the microphone chip to be positioned optimally for sensitivity while simplifying the overall wiring structure
2Volume of stationary object
If the microphone chip is mounted on the substrate to cover the acoustic hole, then the capacity of the back chamber is increased, but contamination and sticking issues occur due to soldering fume
Solution Approach 1:
The acoustic hole is formed in the substrate before mounting the microphone chip. The chip is then positioned to cover the acoustic hole in a subsequent step, allowing the back chamber to be established first while protecting the chip from soldering fume contamination during the mounting process
Solution Approach 2:
The substrate acts as an intermediary structure that provides both the acoustic hole for back chamber formation and a protected mounting surface for the microphone chip, separating the chip from direct exposure to soldering fume while maintaining acoustic functionality
3Reliability
If the internal conductor wiring is arranged in the recess from upper surface to lower end, then electrical connection is achieved, but the processing becomes troublesome and manufacturing cost increases
Solution Approach 1:
The complex internal conductor wiring structure is extracted and replaced with a simplified bonding pad structure on the rear surface of the substrate. The microphone chip is electrically connected to the substrate through bonding wires that contact the bonding pads, eliminating the need for intricate internal wiring within the recess and significantly simplifying the manufacturing process
Data Source
AI summary
The semiconductor device has a simplified structure which includes a package structure in which a member for mounting a semiconductor element is separate from a member including a signal input/output unit. A microphone package is configured with a cover and a substrate. A microphone chip and a circuit element are adhered and fixed to a top surface of a recess formed in the cover. A plurality of bonding pads are arranged on the lower surface of the cover on the outer side of the recess. A bonding wire is connected to the circuit element and the bonding pad. The substrate includes a signal input/output terminal serving as the signal input/output unit, and a connection electrode, conducted with the signal input/output terminal, is arranged facing the bonding pad on the upper surface of the substrate. The substrate, cover, connection electrode, and bonding pad are joined with a conductive member.