Microphone Multilayer PCB Shielding for ASIC Thermal Isolation
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Solution Overview
Problem
Existing microphones face performance issues due to heat generated by the MEMS and ASIC chips affecting other devices through substrate dissipation and thermal air movement in the cavity.
Innovation Solution
A microphone design with a multilayer printed circuit board structure incorporating shielding layers and avoiding apertures to accommodate and electrically connect chip assemblies, allowing heat dissipation through shielding layers and grounding points, reducing thermal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is achieved through substrate or thermal air movement in cavity, then heat can be dissipated, but other devices performance is affected by the heat
Solution Approach 1:
The patent segments the heat dissipation function from the general cavity space by creating a dedicated heat dissipation cavity separated by shielding layers. The ASIC chip is isolated in its own thermal zone with dedicated heat dissipation paths through shielding layers to ground points, preventing thermal interference with other components in the main cavity.
Solution Approach 2:
The patent extracts the heat-generating ASIC chip from the main device cavity and places it in a separate heat dissipation cavity formed by shielding layers. This extraction allows independent thermal management of the ASIC chip through dedicated heat dissipation paths to ground points, isolating its thermal effects from other sensitive devices.
2Device complexity
If ASIC chip is placed in cavity with other devices, then device integration is achieved, but heat from ASIC chip affects performance of other devices
Solution Approach 1:
The patent implements a nested structure where the heat dissipation cavity with ASIC chip is embedded within the larger microphone housing and circuit board structure. The shielding layers form nested thermal zones that allow integrated device placement while maintaining thermal isolation through multiple nested shielding layers connected to ground points.
Solution Approach 2:
The shielding layers act as intermediary thermal barriers between the ASIC chip and other devices. These conductive shielding layers provide dedicated heat dissipation paths from the ASIC chip to ground points, serving as thermal mediators that conduct heat away from sensitive areas without requiring direct thermal contact between the ASIC and other components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from ASIC and MEMS chips, minimizing thermal interference with other components and enhancing overall performance.
Implementation Method 1
the printed circuit board is a multilayer structure including a chip mounting layer, a first alignment layer, a plurality of shielding layers, a second alignment layer, and an SMT layer arranged in sequence from one side close to the first chip assembly to the other side away from the first chip assembly
Data Source
AI summary
The present disclosure discloses a microphone including a shell, a printed circuit board enclosing a cavity together with the shell, a first chip assembly located in the cavity, and a second chip assembly embedded and accommodated in the printed circuit board. The printed circuit board is a multilayer structure including a chip mounting layer, a first alignment layer, a plurality of shielding layers, a second alignment layer, and an SMT layer arranged in sequence, each of the plurality of shielding layers is connected with a grounding point of the printed circuit board and provided with an avoiding aperture running through it. Compared with the related art, the microphone disclosed by the present disclosure could avoid a heat generated by the operation of the first AISC chip and the second ASIC chip affecting the performance of other devices.