Microphone Pre-mold With Bent Leadframe and Through-Hole
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Solution Overview
Problem
The manufacturing process of microphone assemblies, particularly for MEMS microphone chips, lacks efficiency and cost-effectiveness in providing a sufficient rear volume and effective shielding against electromagnetic interference.
Innovation Solution
A pre-mold comprising a bent leadframe and a mold body with a through-hole for sound wave transmission, where the mold body encapsulates the leadframe to form a cavity that accommodates a microphone, providing a large rear volume and potential for electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If a multilayer substrate with lid and through-hole is used to provide rear volume and electromagnetic shielding, then the microphone assembly achieves sufficient rear volume and shielding, but the manufacturing process becomes complex and costly
Solution Approach 1:
The patent combines the leadframe structure with the housing function, integrating electromagnetic shielding and rear volume provision into a single component. The leadframe serves dual purposes: providing electrical connections and forming the housing structure with the through-hole, eliminating the need for separate multilayer substrates and lids.
Solution Approach 2:
The leadframe is designed to perform multiple functions simultaneously: it provides electrical connections, forms the housing structure, creates the through-hole for sound wave transmission, and provides electromagnetic shielding. This multi-functional design simplifies the overall assembly by reducing the number of separate components.
2Object-affected harmful factors
If a multilayer substrate with lid is used to provide electromagnetic shielding, then the microphone assembly achieves sufficient shielding, but the manufacturing cost increases
Solution Approach 1:
The patent merges the electromagnetic shielding function into the leadframe structure itself. The leadframe acts as both the electrical connection medium and the shielding element, eliminating the need for separate conductive lids and multilayer substrate structures that would increase manufacturing complexity and cost.
3Ease of manufacture
If a simple pre-mold structure is used to reduce manufacturing cost, then the packaging solution becomes cost-effective, but providing sufficient rear volume becomes difficult
Solution Approach 1:
The patent utilizes the three-dimensional space within the leadframe structure to create the rear volume. By forming the leadframe with specific geometries and utilizing the space around the microphone element, the design achieves sufficient rear volume without requiring additional components or complex multilayer structures.
Data Source
AI summary
A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.