Microphone and Pressure Sensor Package Mechanical Decoupling
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Solution Overview
Problem
Existing microphone and pressure sensor packages face challenges in mechanical decoupling from external forces, which can affect the accuracy and reliability of pressure and sound wave detection.
Innovation Solution
A compact package design featuring a carrier with an opening, a microphone device with a diaphragm and perforated back plate, an ASIC device with integrated pressure sensors, and a bottom device for mechanical decoupling, using an adhesive silicone layer and electric connections to enhance mechanical isolation and signal read-out.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the pressure sensor is integrated directly into the package substrate, then the device complexity is reduced, but the sensor becomes sensitive to external forces and mechanical stress
Solution Approach 1:
A decoupling structure (intermediary layer) is introduced between the pressure sensor and the package substrate. This intermediary component mechanically isolates the sensor from external forces while maintaining the integrated package design, thereby resolving the contradiction between integration complexity and sensor accuracy.
2Volume of moving object
If the package size is reduced for compactness, then the volume is minimized, but the mechanical decoupling of the sensor becomes more difficult
Solution Approach 1:
The decoupling structure is nested within the compact package architecture, with the pressure sensor, decoupling layer, and package substrate arranged in a nested configuration. This allows mechanical isolation to be achieved within a minimized volume by efficiently utilizing the three-dimensional space.
3Length of moving object
If the diaphragm is positioned closer to the back plate to reduce package height, then the package height is minimized, but the detection sensitivity may be affected
Solution Approach 1:
The optimal distance between the diaphragm and back plate is determined as a critical parameter. By carefully controlling this parameter within a specific range, the package achieves compact height while maintaining sufficient detection sensitivity, resolving the contradiction between miniaturization and measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved mechanical decoupling and reduced sensitivity to external forces, allowing for accurate detection of ambient pressure and sound waves while maintaining compact dimensions.
Implementation Method 1
An adhesive layer comprises silicone between the bottom device and the ASIC device
Implementation Method 2
a microphone device including a diaphragm and a perforated back plate arranged above the opening
Implementation Method 3
an sensor element provided for a pressure sensor is integrated in the ASIC device. The pressure that is present outside the cavity is transferred to the sensor element
Data Source
Figure 1~2
Figure 3~4
Figure 5~7
AI summary
The microphone and pressure sensor package comprises a carrier (1) with an opening (16), a microphone device (20) including a diaphragm (21) and a perforated back plate (22) arranged above the opening (16), an ASIC device (6), and a cover (9) forming a cavity (17) between the carrier (1) and the cover (9). The ASIC device (6) and the microphone device (20) are arranged in the cavity (17). A sensor element (7) provided for a pressure sensor is integrated in the ASIC device (6). The pressure outside the cavity (17) is transferred to the sensor element (7) through the opening (16), the diaphragm (21), and the back plate (22).