Miniature Microphone Protection Frame With Etched Shielding
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Solution Overview
Problem
Existing miniature microphone manufacturing processes are complex and inefficient, with CNC processing required for hole formation, leading to material wastage and potential short circuits due to electromagnetic shielding layers contacting internal components.
Innovation Solution
A protection frame for miniature microphones is designed with a metal shielding layer and insulating mechanism on the inner surface, using a circuit board material to achieve electromagnetic shielding while preventing short circuits, and a simplified manufacturing process that saves raw materials by using a resin substrate with strategically formed holes and shielding layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If CNC processing (punching, drilling, milling) is used to form holes and long holes for the frame, then the frame structure can be manufactured, but the machine process becomes complicated and material utilization is reduced
Solution Approach 1:
The patent replaces complex mechanical CNC processing with a chemical etching process. The frame is formed by etching patterns on a circuit board substrate using photoresist coating and chemical etching solutions, eliminating the need for punching, drilling, and milling operations while simplifying the manufacturing process.
Solution Approach 2:
The patent changes the manufacturing approach from mechanical removal of material to chemical dissolution. By controlling etching parameters such as solution concentration, temperature, and exposure time, the frame structure is formed with high precision without requiring complex mechanical machinery.
2Reliability
If long holes are processed around the frames to form concave surfaces and conducting layers, then the electromagnetic shielding structure can be created, but the long holes take up substrate space and reduce material utilization
Solution Approach 1:
The patent extracts only the essential frame structure from the substrate without creating unnecessary long holes. The electromagnetic shielding is achieved through the frame's conducting layers and the circuit board's ground planes, eliminating the need for space-consuming long holes while maintaining shielding effectiveness.
Solution Approach 2:
The circuit board substrate serves multiple functions: it provides the frame structure, contains the conducting layers for electromagnetic shielding, and maintains mechanical support. This multi-functionality eliminates the need for separate long holes for shielding, improving material utilization.
3Reliability
If the conducting layer is configured on the inner lateral sides of the frame for electromagnetic shielding, then the shielding function is achieved, but the conducting layer may contact electronic elements and cause short circuits
Solution Approach 1:
The patent introduces an insulating layer as an intermediary between the conducting layer on the frame's inner lateral sides and the electronic elements. This insulating layer prevents direct contact and potential short circuits while allowing the conducting layer to maintain its electromagnetic shielding function.
Solution Approach 2:
The patent applies different properties to different parts of the frame structure. The outer surfaces have conducting layers for shielding, while the inner surfaces contactting electronic elements have insulating properties, creating localized functional zones that simultaneously achieve shielding and prevent short circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable electromagnetic shielding while preventing short circuits and simplifying the manufacturing process, reducing material usage and production costs.
Implementation Method 1
a first metal shielding layer 22 is provided on the inner surface of the body portion 20... to achieve electromagnetic shielding
Implementation Method 2
an insulating layer 23 is further provided on the inner surface of the metal shielding layer 22... to prevent short circuits inside the miniature microphone
Data Source
AI summary
A method of manufacturing a protection frame used in a miniature microphone is provided. In one embodiment, the method comprises the steps of: (1) preparing a substrate made of an insulating material with a prescribed thickness and a prescribed area; (2) forming a plurality of holes at prescribed intervals on the substrate; (3) forming a first metal shielding layer on the inner surface of each of the plurality of holes formed on the substrate; (4) filling an insulating material in the plurality of holes; (5) forming a plurality of extended portions on the surfaces of both sides of the substrate, each extended portion covering a part of the end face of the insulating material and the whole end face of the first metal shielding layer of a hole; (6) forming a cavity in each insulating material-filled hole, the caliber of each cavity being slightly smaller than the inner caliber of the corresponding extended portion formed in the above mentioned step (5); and (7) cutting the plurality of holes from the substrate to produce a collection of protection frames.