Microphone Rear Volume Expansion via Partitioned Cavity Design

The patent introduces a decoupling element as an intermediary component between the housing and the MEMS chip. This decoupling element absorbs thermomechanical stress and dimensional tolerance variations from the housing, preventing them from being transmitted to the sensitive MEMS chip. The decoupling element acts as a buffer that mediates the mechanical connection while isolating the MEMS chip from harmful thermomechanical effects, thereby enabling top port configuration with increased rear volume without compromising chip reliability.

The patent employs a flexible membrane or thin film as the mounting structure for the MEMS chip. Instead of rigid clamping between housing parts, the flexible membrane provides secure fixation while accommodating dimensional tolerances and thermomechanical movements. The flexibility of the membrane allows it to deform elastically under stress, preventing stress concentration on the chip while maintaining stable positioning. This approach replaces the rigid mechanical constraint with a compliant structure that protects the chip from thermomechanical damage.

The patent divides the housing into modular segments or standardized components that can be assembled in different configurations. By segmenting the housing structure into interchangeable modules (such as separate acoustic chambers, mounting brackets, and covering elements), the design achieves versatility without requiring complex monolithic structures. This modular approach allows the same basic components to be used across different microphone models and configurations, reducing overall complexity while maintaining adaptability for top port arrangements and enabling cost-effective production and miniaturization.