Microphone Encapsulation With Segmented Acoustic Paths
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Solution Overview
Problem
Conventional microphones with a single acoustic transducer suffer from poor audio capture performance and noise suppression due to shared acoustic through-holes with sound inlet holes, leading to decreased audio quality.
Innovation Solution
A microphone encapsulation structure featuring a plurality of acoustic transducers arranged on a PCB substrate with separate acoustic through-holes and ASIC chips connected via gold wire, ensuring sound travels the same distance to each transducer, reducing noise and maintaining sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple acoustic transducers share a common acoustic cavity with sound inlet holes, then the microphone structure is compact, but noise is generated and audio performance deteriorates
Solution Approach 1:
The patent divides the acoustic path into separate segments: sound inlet holes lead to a sound inlet cavity, while acoustic transducers have dedicated acoustic through-holes leading to an acoustic cavity. This segmentation prevents sound waves from taking different paths and eliminates the noise caused by shared acoustic cavities, while maintaining a compact overall structure.
2Measurement precision
If multiple acoustic transducers are used to improve audio capture performance, then audio quality improves, but the acoustic through-holes share a common cavity leading to noise
Solution Approach 1:
The patent implements separate acoustic pathways for each transducer by providing individual acoustic through-holes in the PCB substrate, while sound inlet holes lead to a separate sound inlet cavity. This segmentation allows multiple transducers to operate independently without noise interference, maintaining high audio capture performance.
3Device complexity
If sound travels through shared acoustic cavities to multiple transducers, then the structure is simplified, but sound travel distances differ causing noise
Solution Approach 1:
The patent segments the acoustic structure into distinct pathways: sound inlet holes connect to a sound inlet cavity, while each acoustic transducer has its own acoustic through-hole connecting to the acoustic cavity. This segmentation ensures equal sound travel distance to each transducer without requiring complex structural adjustments.
Solution Approach 2:
The patent applies local quality by positioning acoustic transducers at specific locations on the PCB substrate and providing acoustic through-holes at corresponding positions, ensuring that each transducer receives sound waves at the optimal distance and angle, thereby eliminating noise from unequal sound travel.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses noise and enhances audio performance by ensuring consistent sound quality and sensitivity across multiple transducers, comparable to a single transducer, while maintaining compactness and electrostatic shielding.
Implementation Method 1
The acoustic transducer 2 converts sound pressure into electrical signals
Implementation Method 2
a plurality of ASIC (Application Specific Integrated Circuit) chips each connected to one of the plurality of acoustic transducers via gold wire
Data Source
AI summary
The invention discloses a microphone encapsulation structure having a plurality of transducers, comprising: a housing; a circuit base plate, wherein the circuit base plate and the housing form an acoustic cavity, and a first acoustic through-hole is provided on the circuit base plate; a PCB (Printed Circuit Board) substrate disposed at a top of the circuit base plate, wherein the PCB substrate is provided with a plurality of second acoustic through-holes and the PCB substrate is provided with: a plurality of acoustic transducers each disposed directly above one of the plurality of second acoustic through-holes; and a plurality of ASIC (Application Specific Integrated Circuit) chips each connected to one of the plurality of acoustic transducers via gold wire.