Microphone Sensor Vertical Stacking Reduces Parasitic Components
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Solution Overview
Problem
Conventional microphone sensors have a large size and parasitic components due to the horizontal placement of sound sensing and control modules, which complicates manufacturing and affects electrical performance.
Innovation Solution
The microphone sensor design includes a cover with a receiving groove and an air inlet, positioning the sound sensing module within the receiving space, and electrically connecting it to a control module via a contact unit, which reduces size and manufacturing costs while minimizing parasitic components by simplifying signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sound sensing module and control module are disposed horizontally on a substrate, then the electrical connection can be established, but the size of the microphone sensor and parasitic components increase
Solution Approach 1:
The patent transitions from horizontal disposition of modules to vertical stacking arrangement. The sound sensing module is positioned above the control module on the substrate, with electrical connections established through vertical vias and contact pads. This three-dimensional vertical integration reduces the horizontal footprint and overall device size while maintaining reliable electrical connectivity between modules.
Solution Approach 2:
The patent implements a nested configuration where the sound sensing module is positioned within the vertical projection area of the control module, and both are integrated within the cover structure. The receiving groove in the cover accommodates the stacked modules, creating a compact nested arrangement that minimizes the overall device volume while preserving electrical connection pathways.
2Reliability
If the sound sensing module and control module are disposed horizontally on a substrate, then the electrical connection can be established, but the device complexity and manufacturing complexity increase
Solution Approach 1:
By stacking modules vertically and using through-substrate vias for electrical connections, the patent simplifies the inter-module connection architecture. The vertical via approach consolidates multiple horizontal connection traces into direct vertical pathways, reducing routing complexity and the number of interconnection layers required, thereby simplifying both device structure and manufacturing processes.
3Reliability
If the sound sensing module and control module are disposed horizontally on a substrate, then the electrical connection can be established, but parasitic components increase
Solution Approach 1:
The vertical stacking configuration with direct via connections minimizes the current path length between the sound sensing module and control module. By eliminating long horizontal trace routes and reducing the number of via transitions, the patent decreases parasitic inductance and resistance in the signal paths, thereby reducing harmful parasitic effects while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the overall size of the microphone sensor, lowers manufacturing costs, and enhances electrical performance by minimizing signal distance and parasitic components.
Implementation Method 1
The piezoelectric MEMS microphone sensor is formed with a vibration film, and when the vibration film is adjusted by an external sound (e.g., music), an electrical signal occurs due to a piezoelectric effect and thus a sound pressure is measured.
Implementation Method 2
The capacitive MEMS microphone sensor is formed with a fixed film and a vibration film. Accordingly, when a sound (e.g., music) is applied from the exterior to the vibration film, while a gap between the fixed film and the vibration film is adjusted, a capacitance value changes. The sound pressure is changed into an electrical signal at this time.
Data Source
AI summary
A microphone sensor provides, a receiving space disposed on a cover and a control module and positioned with a sound sensing module in the receiving space. The microphone sensor includes a cover having a receiving groove formed at a lower portion and an air inlet that a sound signal flow in through within a control module coupled to the lower portion of the cover. Furthermore, a sound sensing module is coupled to the control module and positioned at the receiving groove.