Microphone With Three-Dimensional Substrate Unit
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Solution Overview
Problem
Existing microphones with integrated light sources face challenges in miniaturization due to the need for electrical shielding and the complexity of circuit board connections, leading to increased size and susceptibility to mechanical stress, which can result in connection failures.
Innovation Solution
A three-dimensionally connected substrate unit comprising a conversion substrate, a light source substrate, and a connection substrate, where the signal and power lines are connected directly without lead wires, reducing the mechanical load on solder connections and allowing for a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional circuit board connections with lead wires are used, then electrical connections can be established, but the mechanical load on solder connections increases and the device size increases
Solution Approach 1:
The patent merges the conversion substrate, light source substrate, and connection substrate into a single integrated substrate unit. This consolidation eliminates the need for separate lead wires and multiple discrete connections, thereby reducing mechanical load on solder joints and minimizing device size while maintaining electrical connectivity.
Solution Approach 2:
The patent extracts and eliminates the lead wire component from the traditional microphone structure. By directly connecting signal and power lines to the substrates without intermediate lead wires, the design reduces mechanical stress points and simplifies the overall structure, improving reliability while compacting the device.
2Adaptability or versatility
If multiple separate substrates are used for conversion, light source, and connection, then functional separation is achieved, but device complexity and size increase
Solution Approach 1:
The patent combines three functionally distinct substrates (conversion substrate for impedance conversion, light source substrate for LED mounting, and connection substrate for signal/power connections) into a single integrated substrate unit. This merging maintains functional separation through dedicated regions on the same substrate while eliminating the complexity of managing multiple separate components and their interconnections.
3Reliability
If lead wires are used for connecting signal and power lines, then electrical connections are established, but mechanical stress and connection failure risk increase
Solution Approach 1:
The patent removes lead wires from the connection architecture entirely. Signal and power lines are directly soldered to the integrated substrate unit, eliminating the additional solder joints that would be required at lead wire connection points. This direct connection method reduces the total number of potential failure points and maintains solder joint strength without the compounding mechanical stress introduced by lead wires.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the miniaturization of the microphone while enhancing the stability of connections and reducing the risk of mechanical failure, allowing for a more compact and reliable device with improved electrical shielding.
Implementation Method 1
a light source (light emitting diode (LED)) is mounted
Implementation Method 2
The light guiding member has a substantially cylindrical shape and includes an incident surface on which the light from the light source is incident, a reflective surface that reflects light from the light source, and an emitting surface that emits light from the reflective surface
Implementation Method 3
a reflective surface that reflects light from the light source
Data Source
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AI summary
A microphone including a light emitting part can be miniaturized. The microphone includes: a microphone unit; an impedance converter that converts output impedance of the microphone unit; a light source that notifies an operation state of the microphone unit; a conversion substrate on which the impedance converter is mounted; a light source substrate on which the light source is mounted; and a connection substrate to which a signal line for transmitting a signal from the impedance converter and a power line for transmitting power to the light source are connected. The conversion substrate, the light source substrate, and the connection substrate are three-dimensionally connected to one another to constitute one substrate unit.