Microphone Package Trench Design Prevents Conductive Paste Short Circuits
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Solution Overview
Problem
The existing microphone package structures often experience short circuits due to conductive paste overflow, leading to disabled sound gathering and processing functions, reduced reliability, and increased maintenance costs.
Innovation Solution
A microphone package structure with trenches formed in the connection between the substrate and the upper cap, maintaining a gap between the trench and the bonding pad, which prevents short circuits by allowing conductive paste to be smeared on the substrate trench, enhancing electromagnetic shielding and connection stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conductive paste is smeared on the substrate connection to attach the upper cap, then the connection between the body and upper cap is established, but the conductive paste may overflow and cause short circuit between bonding pads
Solution Approach 1:
The substrate connection surface is segmented into distinct functional zones: a first connection area for attaching the upper cap with conductive paste, and a second connection area for bonding pads that is physically separated and protected from paste overflow. This segmentation prevents the conductive paste from causing short circuits while maintaining secure mechanical attachment.
2Area of stationary object
If the bonding pads are separated by a short distance to reduce size, then the microphone package is more compact, but the conductive paste can easily bridge between pads causing short circuit
Solution Approach 1:
The substrate connection surface is segmented into distinct functional zones: a first connection area for attaching the upper cap with conductive paste, and a second connection area for bonding pads that is physically separated and protected from paste overflow. This segmentation prevents the conductive paste from causing short circuits while maintaining secure mechanical attachment.
3Strength
If the upper cap is pressed firmly to ensure good connection, then the mechanical connection is strengthened, but the pressure causes conductive paste to overflow onto bonding pads
Solution Approach 1:
The substrate connection surface is segmented into distinct functional zones: a first connection area for attaching the upper cap with conductive paste, and a second connection area for bonding pads that is physically separated and protected from paste overflow. This segmentation prevents the conductive paste from causing short circuits while maintaining secure mechanical attachment.
4Device complexity
If no electromagnetic shielding is provided, then the device structure is simpler, but the amplifier circuit experiences serious interference from dense signal transmissions
Solution Approach 1:
A conductive paste layer is applied as an intermediary shielding material between the sound processing unit and the external environment. This conductive paste not only provides mechanical bonding but also acts as an electromagnetic shield, blocking interference from dense signal transmissions in mobile telephones while maintaining structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short circuits, increases the durability of the microphone, and reduces maintenance costs by ensuring a secure and stable connection while maintaining effective electromagnetic shielding around the sound processing unit.
Implementation Method 1
smear a layer of conductive paste on the substrate trench inside the microphone... forms the package structure of microphone... there would be a circular electromagnetic shelter effect in the sound processing unit
Data Source
AI summary
A kind of microphone package structure includes at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bonding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste.