Microphone Unit Locating Walls for MEMS Mounting Precision
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Solution Overview
Problem
Conventional microphone units face challenges in accurately mounting MEMS chips due to reduced size, leading to potential displacement and blockage of the sound passage, which affects the desired characteristics of the microphone.
Innovation Solution
Incorporating locating walls around the board opening portion to accurately position and mount the electroacoustic conversion portion, preventing blockage and ensuring stable manufacturing of high-performance microphone units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the microphone unit size is reduced, then the device becomes more compact and suitable for modern electronics, but the mounting precision of the MEMS chip deteriorates making it difficult to accurately position the chip
Solution Approach 1:
The board is designed with locating walls formed in advance before MEMS chip mounting. These locating walls are pre-positioned to guide and constrain the MEMS chip during assembly, eliminating the need for complex real-time positioning adjustments and ensuring accurate placement even in miniaturized devices
Solution Approach 2:
Locating walls are introduced as intermediary structures between the board and the MEMS chip. These walls act as a mechanical mediator that transfers and constrains the positioning force, ensuring the MEMS chip is accurately located relative to the sound passage opening without requiring direct precision alignment between the chip and board
2Productivity
If the MEMS chip position is not accurately adjusted, then the assembly process becomes simpler and faster, but adhesive may enter the sound passage blocking it and preventing desired microphone characteristics
Solution Approach 1:
The locating walls are designed to preemptively prevent adhesive from entering the sound passage by creating a physical barrier and defining a controlled application area. The walls constrain the adhesive to specific regions away from the sound passage opening, eliminating the risk of blockage even when assembly precision varies
Solution Approach 2:
The locating walls serve as an intermediary barrier between the adhesive application area and the sound passage. This intermediate structure allows fast assembly with simplified positioning while reliably preventing adhesive migration into the sound passage, thus maintaining both productivity and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise mounting of the MEMS chip, preventing blockage and ensuring the production of high-performance microphone units with stable characteristics, capable of effectively converting sound pressure into electrical signals.
Implementation Method 1
an electroacoustic conversion portion (MEMS chip 11) which includes a diaphragm (112) vibrated by sound pressure and which converts the sound pressure into an electrical signal
Data Source
AI summary
A microphone unit is provided with an electroacoustic conversion portion that includes a diaphragm vibrated by sound pressure and that converts the sound pressure into electrical signals and a board on which the electroacoustic conversion portion is mounted. In the board, there are provided a board opening portion that is formed to face the diaphragm and locating walls that come in contact with the electroacoustic conversion portion to locate the electroacoustic conversion portion.