Metal Micropillar Support Pillar with Oxide Encapsulation

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Solution Overview

Problem

Conventional support pillars in semiconductor technology, manufactured by MEMS or CMOS processes, lack sufficient strength to withstand strong vibrations and etching, which affects the stability and longevity of movable components in sensors and actuators.

Innovation Solution

A support pillar structure comprising multiple metal micropillars encapsulated with an oxide layer, forming a reinforced column shape to enhance structural strength, similar to reinforced concrete, which improves the stability and durability of movable components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a conventional metal pillar encapsulated with oxide layer is used as support pillar, then the manufacturing process is simple, but the strength and resistance against strong vibration and etching is insufficient

Engineering Contradiction:
ImprovestrengthVSAvoidstructure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The support pillar employs a composite structure consisting of multiple metal micropillars (first metal micropillars and second metal micropillars) combined with oxide encapsulation layers. This composite design integrates the mechanical strength of metal with the protective and insulating properties of oxide, thereby significantly enhancing the overall strength, vibration resistance, and etching resistance of the support pillar while maintaining a manageable structural complexity through systematic arrangement of the composite elements.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The support pillar is segmented into multiple discrete metal micropillars (first metal micropillars and second metal micropillars) rather than using a single solid pillar. These segmented micropillars are arranged in specific patterns and connected through conductive layers, which distributes mechanical stress and enhances vibration resistance while allowing the oxide encapsulation to protect each segment individually, thus improving strength without excessive complexity.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the support pillar structure is reinforced to improve strength, then the resistance to vibration and etching improves, but the manufacturing complexity increases

Engineering Contradiction:
ImprovestabilityVSAvoidmanufacturing ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The oxide encapsulation layers are formed preliminary around the metal micropillars before final assembly and connection. This preliminary encapsulation provides immediate protection against etching and enhances structural stability from an early stage in the manufacturing process, ensuring reliability is established early while allowing subsequent manufacturing steps to focus on precise positioning and connection of the micropillars.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The oxide encapsulation layers serve multiple functions simultaneously: they provide mechanical strength enhancement, protection against etching, electrical insulation between metal micropillars, and structural support. This multi-functionality improves reliability across multiple performance dimensions while avoiding the need for separate components for each function, thereby maintaining manufacturing ease.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Strength

If multiple metal micropillars are used to form the support pillar, then the structural strength and vibration resistance improve, but the device complexity increases

Engineering Contradiction:
Improvestructural strengthVSAvoidpillar structure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The support pillar uses a composite arrangement of first metal micropillars and second metal micropillars with distinct functions and properties. The first metal micropillars provide primary structural support, while the second metal micropillars enhance connection and conductivity. This functional segmentation within the composite structure improves structural strength and vibration resistance while managing complexity through clear functional differentiation of the composite elements.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The multiple metal micropillars are arranged in a three-dimensional configuration with vertical and horizontal positioning, creating a spatial network structure. This dimensional arrangement distributes mechanical loads across multiple dimensions, enhancing structural strength and vibration resistance while the regular geometric pattern of the arrangement keeps the structural complexity manageable through predictable spatial relationships.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The reinforced support pillar structure provides better resistance against vibrations and etching, enhancing the stability and extending the lifespan of movable components in sensors and actuators while maintaining flexibility and rigidity.

Implementation Method 1

The first oxide encapsulation layer fully or partially encapsulates the plurality of first metal micropillars to insulate the plurality of first metal micropillars from air

Methodology Applied
Scientific EffectOxidation: Oxidation

Data Source

PatentUS9902610B2Support pillar
Publication Date: 2018.02.27 FORT INSTR CO LTD
  • US9902610B2 patent drawing
  • US9902610B2 patent drawing
  • US9902610B2 patent drawing

AI summary

A support pillar is formed under a movable film for support. The support pillar includes a plurality of first metal micropillars, a base metal connection pillar layer and a first oxide encapsulation layer. The first metal micropillars are formed under the movable film and conductively connected to the movable film via metal connection. The base metal connection pillar layer is formed under the first metal micropillars and conductively connected to the first metal micropillars. The first oxide encapsulation layer fully or partially encapsulates the first metal micropillars to insulate the first metal micropillars from air, and shape the support pillar into a column shape.