Microplate Tape Piece for Rapid Heat Transfer
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Solution Overview
Problem
Conventional microplates face challenges in providing satisfactory heat transfer during thermal procedures due to the blocking of sample wells by skirt and frame portions, leading to uneven temperature gradients and inadequate thermal mass distribution, and require new molds for size or pattern changes, limiting their adaptability and efficiency.
Innovation Solution
A microplate design featuring a carrier made of rigid material with an embossable, thermally conductive, and low-mass tape piece bonded to the bottom face of the plate, allowing direct contact with heating or cooling media and enabling rapid heat transfer while maintaining structural integrity and flexibility for robotic handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the upper ends of sample wells are blocked by the skirt and frame portion, then the structural integrity is improved, but the heat transfer rate becomes insufficient
Solution Approach 1:
The microplate is divided into two functional parts: a rigid carrier providing structural integrity and a separate thin-walled tape piece providing thermal conductivity. The tape piece is bonded to the bottom face of the carrier, allowing the upper ends of wells to remain unblocked for optimal heat transfer while the carrier maintains structural strength.
Solution Approach 2:
Different parts of the microplate are given different properties: the carrier is made of rigid material for structural support, while the tape piece is made of thermally conductive material for heat transfer. This local differentiation allows each part to optimize its specific function without compromising the other.
2Stability of the object's composition
If the thermal mass of the skirt and frame portion is increased, then the structural stability is improved, but the temperature gradient variation increases
Solution Approach 1:
The structure is segmented into a heavy carrier for stability and a light tape piece for thermal performance. The carrier provides the necessary structural stability while the thin-walled tape piece minimizes thermal mass interference, eliminating temperature gradient variations caused by excessive thermal mass.
Solution Approach 2:
The thermal mass parameter is optimized by using a thin-walled tape piece with low mass for the well-containing portion, while the carrier maintains sufficient mass for structural stability. This parameter differentiation resolves the conflict between stability and temperature uniformity.
3Manufacturing precision
If a new mold is required when the size or pattern of wells is changed, then the manufacturing precision is maintained, but the adaptability decreases
Solution Approach 1:
The well configuration becomes dynamic and changeable through the tape piece, which can be easily reformed or replaced to create different well patterns. The rigid carrier maintains manufacturing precision for the base structure, while the flexible tape allows adaptability for different well sizes and patterns without requiring new molds.
Solution Approach 2:
The well configuration parameters (size, pattern, spacing) can be changed by modifying or replacing the tape piece rather than the entire mold. This allows flexible adaptation of well parameters while maintaining the precision of the carrier structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The microplate achieves rapid and uniform heat transfer to samples without thermal mass interference, allowing for accurate optical readouts and improved manufacturing flexibility, as the tape piece is bonded beneath the carrier, ensuring unobstructed heat transfer and reduced temperature gradients.
Implementation Method 1
The tape piece is made of an embossable, thermally conductive, and low mass material... allowing direct contact with heating or cooling media and enabling rapid heat transfer
Data Source
AI summary
A microplate (10) includes a carrier (12) having a plate (20) and an annular perimeter wall (30) to define a recess (34). An array of holes (26) extends through the plate (20). A tape piece (16), die cut from a flexible tape (60) includes an array of wells (54) each extending through and having an opening (56) extending into the well (54). The array of wells (54) has a number and locations corresponding to the array of holes (26). The openings (56) have sizes corresponding to the holes (26). An upper surface (50) of the tape piece (16) is abutted with and bonded to the bottom face (24) of the plate (20) with the openings (56) corresponding to the array of holes (26). The slideable receipt of an annular outer periphery (58) of the tape piece (16) insures that the array of wells (54) are aligned to correspond to the array of holes (26) as die cutting of tape piece (16) insures that the array of wells (54) are at consistent positions relative to the annular outer periphery (58).