Microporous Shield for Mobile Terminal Heat Dissipation
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Solution Overview
Problem
In mobile terminals, heat from the heat source chip cannot be quickly conducted to the heat pipe due to the back-and-forth conversion of the conductive medium in the thermal conductive path, leading to inefficient heat dissipation.
Innovation Solution
A microporous array is used to shield radio frequency signals, with a flexible thermal conductive solid connecting the heat source chip to the heat pipe, ensuring efficient heat transfer through a microporous array with optimized pore size, thickness, and spacing, and a lining thermal conductive layer enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a closed shield is used between the heat source chip and heat pipe, then radio frequency signal shielding is improved, but heat conduction efficiency deteriorates due to back-and-forth conversion of conductive medium
Solution Approach 1:
The shield is designed with a microporous array structure instead of being completely closed. The micropores allow the flexible thermal conductive solid to extend continuously from the heat source chip through the shield to the heat pipe, enabling direct heat conduction without back-and-forth conversion while maintaining radio frequency shielding through the microporous structure
Solution Approach 2:
The invention uses a composite structure combining the microporous array shield with flexible thermal conductive solid materials. The shield material provides both electromagnetic shielding and structural support, while the flexible thermal conductive solid provides continuous thermal conduction path, creating a multi-functional composite system that resolves the contradiction between shielding and heat conduction
2Adaptability or versatility
If multiple conductive mediums are used in the thermal conductive path, then heat transfer flexibility is improved, but heat conduction speed deteriorates due to back-and-forth conversion
Solution Approach 1:
The invention merges the thermal conduction functions across the shield interface by using the same flexible thermal conductive solid on both sides of the shield. This creates a continuous thermal path that eliminates the back-and-forth conversion between different conductive mediums, significantly improving heat conduction speed while maintaining the necessary flexibility through the microporous array structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for rapid heat conduction to the heat pipe, improving heat dissipation efficiency and reducing heat retention in the shielding chamber, effectively addressing the inefficiencies of existing technologies.
Implementation Method 1
a flexible thermal conductive solid connecting the heat source chip to the heat pipe, ensuring efficient heat transfer
Implementation Method 2
one end, which is located close to the heat source chip, of the heat pipe is an evaporation area, the other end which is remote from the heat source chip is a condensation area
Data Source
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AI summary
The disclosure discloses a device for terminal heat dissipation and a mobile terminal, including: a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid; and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield. By means of the disclosure, the problem in the related art that heat cannot be quickly conducted to the heat pipe due to the back-and-forth conversion of the conductive medium in the thermal conductive path is solved, and heat can therefore be quickly conducted to the heat pipe, speeding up an effect of heat dissipation.