Microprism and Microlens Array for Compact LIDAR

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Solution Overview

Problem

Current LIDAR systems rely on external optic systems, making them bulky and unsuitable for small form factor applications, necessitating the development of solid-state devices that maintain a compact size while maintaining effective distance determination capabilities.

Innovation Solution

A LIDAR optical unit incorporating a photonic integrated circuit (PIC) chip with a switchable optical network, microlens, and microprism arrays, which allows for the integration of a laser source and photodetector within a small form factor, enabling efficient beam switching and optical path management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If external optic systems are used in LIDAR systems, then effective distance determination capabilities are achieved, but the system becomes bulky and unsuitable for small form factor applications

Engineering Contradiction:
Improveform factorVSAvoidoptical system complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent combines multiple external optical components (microlens arrays, microprism arrays, beam splitters) into a single integrated optical stack that is directly mounted on the PIC chip. This merging eliminates the need for separate external optical systems while maintaining effective distance determination capabilities, thereby reducing overall system volume and achieving small form factor requirements

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The optical components are arranged in a nested stacked configuration where the microlens array is positioned on one surface of the optical stack and the microprism array is positioned on the opposite surface, with beam splitters and waveguides nested within the stack structure. This nested arrangement maximizes space utilization and minimizes the overall volume of the optical system

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If a photonic integrated circuit with switchable optical network is used, then beam switching and optical path management are improved, but device complexity increases

Engineering Contradiction:
Improvebeam switching capabilityVSAvoidoptical network complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements a switchable optical network within the PIC chip that can dynamically route laser light to different output couplers based on operational requirements. This dynamic switching capability allows the system to adapt between different beam directions and optical paths, enhancing versatility while the integration on the PIC chip manages the complexity through standardized photonic circuits

Inventive Principle:
Principle #15Dynamics

3Length of moving object

If microlens and microprism arrays are integrated on the PIC chip, then compact LIDAR systems with high angular deflection and low thickness are achieved, but manufacturing precision requirements increase

Engineering Contradiction:
ImprovethicknessVSAvoidoptical component alignment
Core Design Contradiction:
Length of moving objectVSManufacturing precision

Solution Approach 1:

The patent segments the optical system into distinct functional layers within the optical stack: microlens arrays on one surface, microprism arrays on the opposite surface, and beam splitting components in between. Each segment is independently fabricated and then precisely aligned during assembly, allowing for optimized manufacturing of each component while maintaining overall precision through modular integration

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an optical stack as an intermediary structure that provides mechanical support and precise positioning for the microlens and microprism arrays. This optical stack acts as a mediator that facilitates accurate alignment between the different optical components and the PIC chip, reducing the direct manufacturing precision requirements on the chip itself while enabling the low thickness profile

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the creation of compact LIDAR systems with high angular deflection and low thickness, facilitating easy manufacturing and effective distance measurement, suitable for applications where space is limited.

Implementation Method 1

an array of microlenses positioned such that a bottom surface thereof is mounted to the PIC chip

Methodology Applied
Scientific EffectRefraction: Refraction

Implementation Method 2

an array of microprisms stacked on the array of microlenses such that a bottom surface of the array of microprisms is mounted to a top surface of the array of microlenses

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS20240045030A1Microprism and microlens array for use in lidar system
Publication Date: 2024.02.08 STMICROELECTRONICS SRL
  • US20240045030A1 patent drawing
  • US20240045030A1 patent drawing
  • US20240045030A1 patent drawing

AI summary

A LIDAR optical unit includes a photonic-integrated-circuit (PIC) affixed to a carrier. The PIC includes an input coupler and an array of output couplers, with a switchable optical network connecting the input coupler to different selected ones of the array of output couplers. A laser source is mounted to the PIC adjacent the input coupler such that laser light generated by the laser source is injected into the input coupler. An optical stack is mounted to the PIC adjacent the array of output couplers to receive laser light extracted from the switchable optical network by the array of output couplers. The optical stack includes an array of microlenses positioned so that a bottom surface thereof is mounted to the PIC, and an array of microprisms is stacked on the array of microlenses so that a bottom surface thereof is mounted to a top surface of the array of microlenses.