Microprocessor assembly adapted for fluid cooling
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Solution Overview
Problem
Conventional air cooling systems are inefficient and costly for data centers due to high energy consumption and mechanical stress, while existing liquid cooling systems face challenges in effectively cooling next-generation microprocessors with high heat fluxes, including thermal resistance, material costs, and risk of water damage.
Innovation Solution
A microprocessor assembly with a heat sink module that uses a plurality of orifices to deliver jet streams of coolant directly to the microprocessor, combined with a vapor quality sensor for efficient heat transfer and a compact, reliable cooling system design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional air cooling systems are used, then cooling is provided to microprocessors, but energy consumption is high and mechanical stress occurs on electronic components
Solution Approach 1:
The patent replaces conventional air cooling with a liquid cooling system that uses pressurized coolant flowing through channels in the substrate and heat sink to remove heat from the microprocessor. The coolant absorbs heat through thermal conduction and convection, significantly improving cooling efficiency while reducing energy consumption compared to high-speed fan systems.
Solution Approach 2:
The patent eliminates mechanical moving parts (fans, motors) by using a liquid cooling system where coolant flow through integrated channels provides cooling. This substitution removes the mechanical stress and vibration problems associated with fan-mounted heat sinks while maintaining effective heat removal.
2Temperature
If liquid cooling systems are used, then cooling efficiency is improved, but thermal resistance and risk of water damage occur
Solution Approach 1:
The patent uses a vapor quality sensor as an intermediary monitoring device that detects the phase state of the coolant. By monitoring vapor quality, the system can detect potential issues before they lead to water damage, allowing for preventive action while maintaining the high cooling efficiency of liquid cooling.
Solution Approach 2:
The patent monitors and controls coolant parameters (temperature, pressure, vapor quality) to optimize cooling performance while preventing conditions that could lead to water damage. By maintaining appropriate parameter ranges, the system achieves high cooling efficiency without compromising reliability.
3Temperature
If heat sinks are mounted on microprocessors, then heat is dissipated, but mechanical stress and vibration fatigue occur
Solution Approach 1:
The patent uses liquid coolant flowing through channels to transfer heat away from the microprocessor, eliminating the need for heavy heat sinks mounted directly on the processor. This hydraulic cooling method provides effective heat dissipation without the mechanical stress and vibration issues associated with physical heat sink mounting.
4Temperature
If CRAC units are installed in data centers, then cooling capacity is provided, but capital expenditures and operating costs increase
Solution Approach 1:
The patent implements cooling at the component level rather than requiring centralized CRAC units for entire data centers. Each microprocessor has its own integrated cooling system with coolant channels in the substrate, segmenting the cooling function and eliminating the need for large, energy-intensive centralized air conditioning systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced thermal performance, reduced energy consumption, and increased reliability by efficiently managing high heat fluxes and maintaining consistent operating temperatures, while minimizing the risk of mechanical failure and water damage.
Implementation Method 1
a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber... configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the outer surface of the integrated heat spreader
Implementation Method 2
a layer of thermal interface material on the top surface of the semiconductor die... transfer heat from the semiconductor die to the integrated heat spreader
Implementation Method 3
a vapor quality sensor for efficient heat transfer
Data Source
AI summary
A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.