Microprocessor Carrier Anti-Tilt and Thermal Separation Mechanism

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Solution Overview

Problem

Current methods for loading and unloading microprocessors from sockets face challenges such as tilting due to unbalanced loads, adhesive forces between the microprocessor and heatsink, and lack of adequate solutions for separation, which can lead to damage to socket contacts and difficulty in removal.

Innovation Solution

A microprocessor carrier with hinge and latch assemblies that facilitates automatic alignment, tilt control during unloading, and automatic separation from the heatsink, using anti-tilt fastener assemblies and retention nuts made from fiber-filled PEEK to stabilize the load and prevent tilting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If large loads are applied to ensure electrical connections are established and stable, then connection reliability is improved, but the risk of tilting and damage to socket contacts increases

Engineering Contradiction:

Improveconnection reliabilityVSAvoidtilting and damage to socket contacts

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a carrier as an intermediary component between the microprocessor and the socket. The carrier includes a loading mechanism with anti-tilt fastener assemblies that distribute and control the application of load, ensuring stable electrical connections while preventing tilting and damage to socket contacts through guided alignment features

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If the microprocessor is attached to heatsink with adhesive forces, then thermal management is improved, but separation difficulty increases

Engineering Contradiction:

Improvethermal managementVSAvoidseparation difficulty

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The patent segments the attachment system into distinct functional components: the carrier with loading mechanism handles mechanical attachment and thermal interface, while the microprocessor can be separately removed from the heatsink. This segmentation allows thermal management through the carrier-heatsink connection while enabling easy microprocessor separation when needed

Inventive Principle:

Principle #1Segmentation

3Object-affected harmful factors

If tilt control features are added to prevent tilting during unloading, then protection of socket contacts is improved, but device complexity increases

Engineering Contradiction:

Improveprotection of socket contactsVSAvoiddevice complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into the carrier component: guided alignment features prevent tilting during loading, anti-tilt fastener assemblies control load distribution during unloading, and automatic separation mechanisms facilitate microprocessor removal. This consolidation provides comprehensive protection without proportionally increasing overall system complexity

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11291115B2Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets

Publication Date: 2022.03.29 INTEL CORP

AI summary

A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.