Microprocessor Fluid Cooling Layout That Purges Heated Waste Flow

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Solution Overview

Problem

Existing fluid-based cooling systems for electrically-powered devices result in uneven cooling due to heating of cooling fluid as it passes through multiple devices in series, leading to inconsistent performance and damage across the array of devices.

Innovation Solution

A thermal management system with base thermal management fixtures that receive cooling fluid, direct it to absorb heat from a device, and expel heated waste fluid, with each fixture receiving only fresh cooling fluid, eliminating the need for extensive heat sinks and allowing for cost-effective materials like plastics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If devices are cooled in serial fluid communication, then the cooling system is simpler and uses less cooling fluid, but the cooling fluid becomes progressively heated and causes uneven cooling across devices

Engineering Contradiction:

Improvecooling system complexityVSAvoidcooling fluid temperature uniformity

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The cooling system is segmented into multiple independent parallel cooling circuits, each with its own cooling fluid flow path. This allows each device to receive independently controlled cooling fluid at consistent temperatures, eliminating the progressive heating problem of serial communication while maintaining system simplicity through modular design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A heat exchanger is introduced as an intermediary component in each parallel cooling circuit. The heat exchanger efficiently transfers heat from the cooling fluid to the device without requiring the cooling fluid to physically contact or flow through the device, enabling independent temperature control for each circuit while maintaining simple overall system architecture.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If extensive heat sinks are used to manage heat from multiple devices, then thermal management is more effective, but the system becomes heavier and more expensive

Engineering Contradiction:

Improvedevice temperature controlVSAvoidheat sink weight

Core Design Contradiction:

TemperatureVSWeight of stationary object

Solution Approach 1:

The traditional mechanical heat sink system is replaced with a fluid-based cooling system using parallel circuits. Instead of relying on passive thermal conduction through large heat sink structures, the invention uses active fluid circulation with pumps and heat exchangers to transfer heat away from devices, achieving effective thermal management with significantly reduced weight.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention employs hydraulic cooling fluid circulation through parallel circuits with heat exchangers. This hydraulic system efficiently removes heat from multiple devices without requiring the extensive solid metal heat sink structures, reducing overall system weight while maintaining effective temperature control.

Inventive Principle:

Principle #29Pneumatics and hydraulics

3Reliability

If expensive materials are used to ensure effective cooling, then thermal management performance is improved, but system cost increases

Engineering Contradiction:

Improvethermal management effectivenessVSAvoidsystem manufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The invention changes the operational parameters of the cooling system by using parallel fluid circulation circuits with controlled flow rates and temperature differentials. This allows the use of conventional, cost-effective materials in heat exchangers and piping while achieving reliable thermal management through optimized fluid dynamics and heat transfer parameters.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The system efficiently recovers cooling fluid after heat exchange, maintaining consistent temperature and composition for reuse in parallel circuits. This closed-loop approach eliminates the need for expensive materials by relying on efficient fluid recirculation and heat exchanger design, reducing manufacturing costs while maintaining thermal management reliability.

Inventive Principle:

Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures consistent cooling across multiple devices, reducing device damage and cost by using lightweight, cheaper materials while maintaining effective thermal management.

Implementation Method 1

the cooling fluid can absorb heat from the at least one electrically-powered device and become heated waste fluid

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20260047250A1Thermal management systems and methods for electrically-powered devices such as microprocessors and microprocessor chips

Publication Date: 2026.02.12 PIKULSKI JOSEPH L

AI summary

Described herein are devices, systems and methods for utilizing fluid cooling to thermally manage electrically-powered devices such as microprocessors and microprocessor chips. Embodiments incorporating features of the present disclosure can purge heated cooling fluid from the system immediately after it has been used to absorb heat from an electrically-powered device, so that other devices in the system do not receive cooling fluid from another device in the system. In some embodiments, cooling fluid can be made to directly impinge on or near an electrically-powered device such as a microprocessor or microprocessor chip.