Microprocessor Interposer Cooling for Heat and Vibration Constraints
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Solution Overview
Problem
On-board computers face challenges in effectively cooling microprocessor chips due to environmental constraints such as vibrations, high temperatures, and confined spaces, which hinder the efficient discharge of heat generated by the chips.
Innovation Solution
The use of an interposer between the microprocessor chip and the casing of the on-board computer, which has a heat exchange surface at least twice greater than the chip's surface area and peripheral wedging rims for secure positioning, facilitates robust and efficient heat dissipation without the need for complex or expensive cooling systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a radiator is placed in contact with the microprocessor chip to drain heat, then heat discharge efficiency is improved, but manufacturing precision and mounting complexity worsen due to the need for uniform contact over the entire chip surface
Solution Approach 1:
The patent introduces a thermal pad as an intermediary element between the microprocessor chip and the radiator. This thermal pad compensates for dimensional tolerances and surface irregularities, ensuring uniform thermal contact without requiring high manufacturing precision. The thermal pad acts as a mediator that maintains consistent contact pressure and thermal conductivity across the entire chip surface, resolving the contradiction between heat discharge efficiency and manufacturing precision requirements.
2Adaptability or versatility
If elastic elements such as springs or gel are provided to take up clearances between components, then adaptability to dimensional tolerances is improved, but reliability worsens due to vibrations causing relative displacements that jeopardize cooling
Solution Approach 1:
The patent extracts the elastic elements (springs or gel) from the system and replaces them with a rigid thermal pad supported by the chip carrier structure. This eliminates the reliability issues caused by vibrations inducing relative displacements in elastic elements. The thermal pad maintains stable thermal contact through rigid mechanical support while still accommodating dimensional tolerances through its compressible nature and large contact area, thus resolving the contradiction between adaptability and reliability.
3Manufacturing precision
If very low manufacturing tolerances with strict compliance to accurate dimensions are provided, then contact uniformity is improved, but manufacturing cost and mounting complexity increase considerably
Solution Approach 1:
The patent applies local quality by concentrating the precision requirements only where absolutely necessary (the interface between the thermal pad and the chip), while allowing greater tolerance in other areas (the thermal pad itself and its interface with the radiator). The thermal pad is designed with specific local properties (thickness, material composition, surface finish) at the chip interface to ensure uniform contact, while the overall structure can be manufactured with standard tolerances. This approach maintains contact uniformity without requiring high precision throughout the entire manufacturing process, thereby reducing costs.
4Adaptability or versatility
If a thick thermal pad is used to compensate for dimensional tolerances, then adaptability to tolerances is improved, but heat discharge efficiency worsens due to reduced thermal conduction
Solution Approach 1:
The patent employs composite materials in the thermal pad design, combining materials with different properties to optimize both tolerance compensation and thermal conduction. The thermal pad may consist of a layered structure or a homogeneous composite material that provides both mechanical compliance (to accommodate dimensional variations) and high thermal conductivity (to maintain efficient heat transfer). This composite approach allows the thermal pad to be thick enough to compensate for tolerances while still maintaining effective thermal conduction, resolving the contradiction between adaptability and heat discharge efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat dissipation from the microprocessor chip, enhancing the cooling efficiency and robustness of the on-board computer while minimizing manufacturing and mounting complexities.
Implementation Method 1
the interposer being configured to diffuse the heat transmitted by the upper face of the microprocessor chip towards the casing of the computer
Implementation Method 2
the interposer has at least on one side a peripheral wedging rim coming into contact with a side wall of the chip carrier
Data Source
AI summary
An on-board computer includes a microprocessor chip with a lower face and an upper face, a chip carrier having an upper face on which the microprocessor chip is mounted, and a casing configured to discharge heat generated by the microprocessor chip in operation. An interposer is disposed between the upper face and the casing. The interposer diffuses the heat transmitted by the upper face of the microprocessor chip towards the casing. The interposer has an upper surface for heat exchange with the casing that is twice or more greater than the surface area of the upper face of the microprocessor chip. The interposer has on one or more sides a peripheral wedging rim coming into contact with a side wall of the chip carrier, and has no more than two peripheral wedging rims, in order to leave the other sides of the interposer free.