Microrelief Resin Composition Scratch Resistance
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Solution Overview
Problem
Current active energy ray-curable resin compositions used for forming microrelief structures on surfaces face challenges such as insufficient scratch resistance, hydrophilicity, and adhesiveness, leading to difficulties in wiping off contaminants like fingerprints and maintaining antireflection performance, especially when used in applications like image display devices.
Innovation Solution
A microrelief structure with a cured product of an active energy ray-curable resin composition is developed, characterized by specific indentation elastic modulus and creep deformation ratios, combined with a polymerizable component comprising polyfunctional acrylates and bifunctional acrylates, which provides enhanced scratch resistance and fingerprint wipeability while maintaining antireflection performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a photocurable resin composition containing acrylate oligomer and photopolymerization initiator is used, then the microrelief structure can be formed, but the cured product has insufficient scratch resistance
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by incorporating silicone oil with specific molecular weight (1000-5000) and specific content (1-10 parts by mass per 100 parts by mass of polymerizable compound). This parameter adjustment transforms the cured product's properties to achieve both high scratch resistance and maintained antireflection performance without compromising the microrelief structure.
Solution Approach 2:
The patent creates a composite resin composition by combining polymerizable compounds (acrylate oligomers, acrylic resins) with silicone oil. This composite approach integrates the structural benefits of the polymer matrix with the surface-adjusting and scratch-resistant properties of silicone oil, resulting in a material that simultaneously achieves high scratch resistance and preserves optical clarity for antireflection functionality.
2Strength
If silicone oil is added to enhance scratch resistance, then slip properties are improved, but the microrelief structure may become damaged or lose antireflection performance
Solution Approach 1:
The patent precisely controls the silicone oil molecular weight (1000-5000) and content (1-10 parts by mass per 100 parts by mass of polymerizable compound). This parameter optimization ensures the silicone oil provides sufficient scratch resistance while maintaining the microrelief structure's shape and antireflection properties, avoiding over-softening or structural damage.
3Ease of operation
If the cured product has low hydrophilicity, then the microrelief structure maintains its shape, but contaminants like fingerprints cannot be wiped off
Solution Approach 1:
The patent adjusts the hydrophilicity parameter by incorporating silicone oil with specific molecular weight and content. This modification enhances the surface's interaction with water and cleaning agents, enabling fingerprint wipeability while the crosslinked polymer matrix maintains the underlying scratch resistance and microrelief structure integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high scratch resistance and satisfactory fingerprint wipeability while maintaining effective antireflection performance, balancing the properties of the microrelief structure to prevent breakage and ensure the surface remains clean and optically clear.
Implementation Method 1
curing the resin composition by irradiation of active energy radiation
Data Source
AI summary
Provided is an article having high scratch resistance and satisfactory fingerprint wipeability. Disclosed is an article having a microrelief structure containing a cured product of a resin composition on the surface, in which the indentation elastic modulus (X) [MPa] and the creep deformation ratio (Y) [%] of the cured product satisfy the following formulas (1) and (2):80≦X≦560 (1)Y≦(0.00022X−0.01)×100 (2).