Microscale Hollow Metal Bodies With Leak-Proof 3D Encapsulation
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Solution Overview
Problem
Existing micromanufacturing techniques struggle to create 3D microarchitectures with complex geometries that can encapsulate liquids without leaks, as they suffer from irregularities and porosity, limiting their application in areas like drug delivery and impact protection.
Innovation Solution
A process using localized electrodeposition in liquid (LEL) to deposit metal voxels layer-by-layer, controlling voxel distance and overlap to form hollow bodies with dense, leak-proof side walls and customizable geometries, enabling encapsulation of liquids within microscale architectures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If classic UV lithography is used to create microstructures, then 2D structures with topography can be fabricated, but true 3D microarchitectures cannot be created
Solution Approach 1:
The patent replaces classic UV lithography (optical/mechanical system) with two-photon lithography (optical field system) to enable 3D microarchitecture fabrication. The two-photon process uses focused infrared laser beams to selectively photopolymerize resin in three dimensions, achieving true 3D microstructures that cannot be created by planar lithography methods.
Solution Approach 2:
The patent utilizes phase transition of polymer materials through photopolymerization. The two-photon lithography process induces local polymerization of photopolymer resin, transforming it from a liquid/resin state to a solid microstructure state, enabling 3D architecture fabrication.
2Manufacturing precision
If two-photon lithography is used to 3D print microscale architectures, then complex microlattice designs with nanometer resolution can be realized, but the structures remain inherently weak polymer structures
Solution Approach 1:
The patent creates composite microstructures by combining polymer matrices with embedded metal components. The two-photon lithography fabricates polymer microlattices and microarchitectures that serve as composite structures, potentially reinforced with metal particles or coatings to enhance mechanical strength while maintaining nanometer resolution.
Solution Approach 2:
The patent applies local quality enhancement by selectively reinforcing specific regions of the microstructure. Metal components or coatings are applied only to critical load-bearing areas of the microlattice or microarchitecture, rather than uniformly throughout, thereby enhancing strength where needed while maintaining the overall lightweight porous structure.
3Strength
If localized electrodeposition is used to fabricate 3D metal microarchitectures, then metal microstructures can be created, but complex architectures such as microlattices, micropillars, microsprings have not been realized due to process complexity
Solution Approach 1:
The patent segments the complex microarchitecture fabrication process into modular steps: first fabricating simple metal microcomponents using localized electrodeposition, then assembling or combining these segments to form complex architectures like microlattices, micropillars, and microsprings. This segmentation reduces the complexity of directly fabricating complex structures in a single step.
Solution Approach 2:
The patent employs dynamic control of the electrodeposition process, including real-time adjustment of deposition parameters, multi-stage deposition sequences, and adaptive patterning, to enable fabrication of complex architectures while managing process complexity through programmable control.
4Adaptability or versatility
If additive manufacturing is used to create hollow structures, then 3D microarchitectures can be fabricated, but irregularities and holes occur between voxels preventing liquid encapsulation
Solution Approach 1:
The patent extracts and addresses the specific problem of inter-voxel irregularities by implementing additional sealing steps or process modifications targeted at eliminating holes and gaps between deposited voxels, thereby enabling reliable liquid encapsulation while maintaining hollow structure fabrication capability.
Solution Approach 2:
The patent applies preliminary action by performing sealing operations or process adjustments before finalizing the hollow structure, ensuring that inter-voxel connections are fully formed and sealed to prevent liquid leakage. This includes preliminary deposition of sealing layers or materials at critical interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process allows for the fabrication of structurally error-free, low-surface roughness hollow bodies that can encapsulate and release liquids, providing impact protection and damage sensing capabilities through fluorescence markers.
Implementation Method 1
a process in which a metal is deposited from an electrolyte solution containing metal ions on a substrate
Data Source
AI summary
A hollow body has a bottom, an upper end wall, and side walls extending between the bottom and the upper end wall. The upper end wall and side walls are made of metal. The cavity within the hollow body has a volume in the range between 1 picoliter to 1,000 picoliter. The upper end wall comprises at least one opening. The hollow body is suitable for encapsulating small amounts of liquid, or a small micro-electromechanical system, and may be used for the controlled release of pharmaceutical components.