Microscale Optoelectronic Packages With Integrated ESD Protection
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Solution Overview
Problem
Conventional optoelectronic devices, such as LEDs and laser diodes, face limitations in achieving high flux density without overheating, increased susceptibility to electrostatic discharge, and complex packaging that requires numerous components and assembly steps, which hinders efficient production and performance testing.
Innovation Solution
The development of microscale optoelectronic device articles with integrated electrostatic discharge protection and electrically conductive microvias on a common substrate, allowing for high flux density and reduced spatial footprint, while providing thermal management and electrostatic protection through electrically isolated thermal contact pads and radiation sensing elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional optoelectronic devices operate at high flux density, then light output increases, but thermal overheating occurs
Solution Approach 1:
The device separates thermal management and electrical functions into distinct components: electrically isolated thermal contact pads provide thermal pathways while electrical shields prevent electrical interference, allowing independent optimization of thermal dissipation and electrical performance at high flux densities
Solution Approach 2:
Electrically conductive microvias with integrated shields act as intermediary structures that provide both electrical connectivity and thermal management functions, serving as mediators between the emitter diode and external circuitry while maintaining electrical isolation for thermal paths
2Device complexity
If conventional devices lack electrostatic discharge protection, then device complexity is reduced, but susceptibility to electrostatic discharge increases
Solution Approach 1:
Multiple protective functions (electrostatic discharge protection, thermal management, and electrical connectivity) are merged into single integrated structures: the ESD diode is integrated with thermal contact pads and microvia shields, reducing the number of discrete components while enhancing protection capabilities
Solution Approach 2:
The electrically conductive microvia shields serve multiple functions simultaneously: they provide electrostatic discharge protection, act as thermal pathways, and offer electrical shielding, making single structures that perform multiple protective roles
3Area of stationary object
If multiple LED dies are placed close together to reduce spatial footprint, then color mixing perception improves, but thermal management becomes more difficult
Solution Approach 1:
Each LED die is equipped with dedicated electrically isolated thermal contact pads and associated microvias, segmenting the thermal management system into discrete units that can handle heat independently, allowing close spacing of multiple dies without thermal interference
Solution Approach 2:
The electrically conductive microvia shields act as intermediary thermal pathways between closely spaced LED dies and the substrate, providing efficient heat transfer routes that enable high-density die arrangements while maintaining effective thermal management
4Reliability
If conventional packaging uses numerous discrete components, then functional requirements are met, but manufacturing complexity and assembly steps increase
Solution Approach 1:
Multiple discrete protective components (ESD protection elements, thermal management elements, and electrical shielding elements) are merged into integrated structures formed directly on the substrate, reducing the number of separate assembly steps while maintaining all necessary functions
Solution Approach 2:
Protective structures such as ESD diodes, thermal contact pads, and microvia shields are formed preliminarily during substrate fabrication before device assembly, eliminating subsequent assembly steps and simplifying the manufacturing process while ensuring reliable functional performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high flux density operation with reduced thermal issues and electrostatic discharge susceptibility, simplifying the packaging process and enabling simultaneous testing and binning of multiple devices, thus improving efficiency and reliability.
Implementation Method 1
a secondary electrostatic discharge (ESD) diode operating in the breakdown region (i.e., in a conductive state) is typically connected in parallel with the LED
Implementation Method 2
a secondary electrostatic discharge (ESD) diode operating in the breakdown region (i.e., in a conductive state)
Implementation Method 3
The first method utilizes a phosphoric coating deposited on the LED die, with the phosphor serving to convert portions of the light into longer wavelengths that lead to the perception of white light
Implementation Method 4
LEDs and laser diodes are solid state devices each having a P-N junction semiconductor diode that emits radiation (e.g., infrared radiation, visible radiation, ultraviolet radiation, and so on) responsive to application of electrical current
Data Source
AI summary
An optoelectronic device article comprises a substrate containing at least one electrically conductive microvia, at least one emitter diode and at least one ESD diode, optionally formed in situ, disposed in or on the substrate, and an electrically conductive path between the foregoing elements. A reflector cavity may be defined in the substrate for receiving the emitter diode(s), with retention elements on the substrate used to retain a lens material. High flux density and high emitter diode spatial density may be attained. Thermal sensors, radiation sensors, and integral heat spreaders comprising one or more protruding fins may be integrated into the article.