Microscale Wire Tensile Testing for Thermal-Athermal EAD Separation
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Solution Overview
Problem
Existing technologies lack effective devices and methods to characterize the thermal and athermal effects of electrically assisted deformation (EAD) in materials, particularly in metals with limited ductility like pure titanium and its alloys, leading to disagreements on the underlying mechanisms.
Innovation Solution
An electro-thermo-mechanical tensile testing device and method using a sample frame with sacrificial supports, a piezo actuator, electronic balance, and digital camera to capture images and weight measurements simultaneously, allowing for the differentiation of thermal and athermal effects in micron-scale wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional tensile testing devices are used to characterize EAD effects, then basic mechanical properties can be measured, but the device cannot differentiate between thermal and athermal effects in electrically assisted deformation
Solution Approach 1:
The patent combines multiple measurement functions (mechanical loading, electrical current application, thermal measurement, and dimensional measurement) into a single integrated testing device. The sample frame integrates electrical contacts, the piezo actuator provides controlled mechanical loading, the optical microscope with camera captures dimensional changes, and the electronic balance measures mass changes, all working simultaneously to differentiate thermal and athermal effects during EAD testing
Solution Approach 2:
The testing device performs multiple functions simultaneously: it applies mechanical tensile loads, passes electrical currents through the sample, measures temperature changes, records dimensional variations, and monitors mass changes. This multi-functional capability allows the device to comprehensively characterize both thermal and athermal effects in electrically assisted deformation without requiring separate testing equipment
2Loss of information
If detailed simultaneous measurements of multiple parameters are performed to characterize EAD mechanisms, then understanding of thermal and athermal effects is improved, but the testing process becomes more complex and time-consuming
Solution Approach 1:
The device performs continuous simultaneous measurements of multiple parameters (load, electrical current, temperature, dimensional changes, and mass) throughout the entire tensile testing process. The optical microscope continuously captures images, the electronic balance continuously monitors mass, and data acquisition records all parameters simultaneously, ensuring no information is lost without requiring multiple separate testing steps that would consume additional time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides accurate and cost-effective characterization of thermal and athermal effects, enhancing the understanding of EAD mechanisms in micron-scale wires, and demonstrating improved manufacturability through reduced yield strength and increased strain to failure.
Implementation Method 1
a piezo actuator coupled to the upper part
Implementation Method 2
The dc power supply is configured to pass a current through the wire sample
Implementation Method 3
the electrical contact pad of the upper part is communicatively coupled to the electrical contact pad of the lower part through the wire sample
Implementation Method 4
a digital camera pointed at the wire sample within the sample frame such that the tracking beads on the wire sample are visible
Implementation Method 5
a weight of known mass coupled to the lower part, and an electronic balance positioned beneath the weight, with the weight resting on the electronic balance
Data Source
AI summary
A method and device for electro-thermo-mechanical tensile testing of wires is disclosed. The device includes a sample frame having upper and lower parts, with the upper part coupled to the lower part through a plurality of sacrificial supports, the upper and lower parts each having an electrical contact pad. The upper and lower parts are electrically non-conductive. The device also includes a wire sample with tracking beads, the wire sample affixed to the upper and lower parts such that the electrical contact pads of the upper and lower parts are communicatively coupled through the wire sample. The device also includes a piezo actuator coupled to the upper part, a weight coupled to the lower part, a power supply configured to pass a current through the wire sample, an electronic balance beneath the weight, and a digital camera pointed at the tracking beads of the wire sample.