Microscanner Multi-Beam Laser Processing for Non-Periodic Patterns
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Solution Overview
Problem
Current laser processing technologies face challenges in efficiently and flexibly processing non-periodic or partially periodic patterns on workpieces, as existing multi-beam systems are limited to periodic structures, leading to inefficiencies in processing speed and control.
Innovation Solution
A laser processing device equipped with a beam splitting unit and an optical control unit featuring an array of reflective microscanners, allowing for the arbitrary selection and positioning of partial beams to achieve precise and flexible processing of multiple sites simultaneously, even in non-periodic patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If existing multi-beam systems are used for periodic structures, then processing efficiency is improved, but flexibility for non-periodic patterns deteriorates
Solution Approach 1:
The patent implements dynamic beam selection and positioning by allowing the optical control unit to arbitrarily select subsets of partial beams from the bundle and position them at different locations on the workpiece. This enables the system to adapt from fixed periodic patterns to flexible non-periodic patterns by dynamically reconfiguring which beams are active and where they are directed, resolving the contradiction between processing efficiency and pattern flexibility.
2Adaptability or versatility
If arbitrary selection of partial beams is implemented, then flexibility for non-periodic patterns is improved, but device complexity increases
Solution Approach 1:
The optical control unit is designed as a universal device that can handle both periodic and non-periodic patterns using the same hardware infrastructure. The beam splitting unit generates a complete bundle of partial beams that can be arbitrarily selected and positioned, making the system multi-functional without requiring separate systems for different pattern types. This universality manages complexity by consolidating control functions rather than multiplying hardware for each pattern type.
3Speed
If parallel processing of multiple sites is implemented, then processing speed is improved, but control complexity increases
Solution Approach 1:
The laser beam is segmented into multiple partial beams that can be independently controlled and directed to different processing sites. The beam splitting unit divides the original beam into a bundle of partial beams, and the optical control unit selectively positions these segmented beams at multiple locations simultaneously. This segmentation enables parallel processing at multiple sites while managing control complexity through modular beam management rather than requiring a completely new control architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and parallel processing of multiple sites on a workpiece with arbitrary spatial combinations, improving processing speed and flexibility by allowing individual positioning and movement of partial beams within their scanning regions, thus overcoming the limitations of traditional systems.
Implementation Method 1
a beam splitting unit, which is disposed downstream of the laser radiation source in the beam direction and is configured for splitting the laser beam into a bundle of partial beams
Implementation Method 2
a beam splitting unit, which is disposed downstream of the laser radiation source in the beam direction and is configured for splitting the laser beam into a bundle of partial beams
Implementation Method 3
an optical control unit, which is disposed downstream of the beam splitting unit in the beam direction and which comprises a reflective optical functional unit formed of an array of reflective microscanners
Implementation Method 4
laser processing device and a method for laser-processing a workpiece at predetermined processing sites
Implementation Method 5
laser processing device and a method for laser-processing a workpiece at predetermined processing sites
Data Source
AI summary
A laser-machining device comprising a laser-radiation source to generate a laser beam and emit it along an optical path; a beam-splitting unit downstream of the laser-radiation source designed to split the laser beam into a bundle of partial beams; an optical control unit downstream of the beam-splitting unit comprising a reflective optical functional unit formed by an array of reflective microscanners, wherein the optical control unit is designed to select any desired number of partial beams in any desired spatial combination from the bundle of partial beams and direct them onto a workpiece, and to position and/or move at least one of those partial beams within a specified partial-beam scanning region of the respective partial beam using the microscanner of the array of microscanners assigned to the respective partial beam, and methods for laser machining a workpiece.