Microscopy Tilt Characterization With Elliptical Distortion Correction
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Solution Overview
Problem
Microscopy technologies, particularly transmission electron microscopes (TEM), face challenges with elliptical distortion that lead to measurement inaccuracies and instability in microelectronic applications like vertical NAND flash memory technology, causing tilting shifts and distortion-induced shifts that affect data reliability.
Innovation Solution
A method for tilting characterization that involves measuring a first and second tilting shift of structures based on different dispositions, with the second disposition being a horizontal flip of the first, and using scalar or vector operations to determine corrected tilting shifts and distortion-induced shifts, effectively decoupling these to obtain accurate tilting measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If microscopy is used to view microscopic structures, then measurement capability is provided, but elliptical distortion causes measurement inaccuracies and instability
Solution Approach 1:
The measurement process is segmented into multiple independent measurements taken at different dispositions (orientations). By dividing the single measurement into multiple measurements and processing them separately, the patent isolates the distortion effect from the actual tilting shift, enabling accurate measurement despite distortion.
Solution Approach 2:
The patent exploits the asymmetric effect of elliptical distortion on measurements taken at different dispositions. By intentionally measuring at multiple different orientations (first disposition, second disposition, etc.), the asymmetric distortion patterns become distinguishable from the actual structural tilting, allowing for mathematical correction.
2Measurement precision
If multiple measurements are taken at different dispositions to correct distortion, then measurement accuracy improves, but measurement complexity increases
Solution Approach 1:
The patent performs preliminary measurements at multiple dispositions before final analysis. By collecting all necessary measurement data first (first tilting shift, second tilting shift, etc.), the complex calculation and correction processes can be performed systematically, simplifying the overall workflow despite the multiple measurement steps.
Solution Approach 2:
The patent creates multiple copies of the measurement process at different dispositions (first disposition, second disposition, third disposition, fourth disposition). Each disposition provides a copied view of the same structures under different orientation conditions, allowing the distortion effects to be differentiated from actual structural properties through comparative analysis.
Data Source
AI summary
Aspects of the disclosure provide a method of tilting characterization. The method includes measuring a first tilting shift of structures based on a first disposition of the structures. The structures are formed in a vertical direction on a horizontal plane of a product. A second tilting shift of the structures is measured based on a second disposition of the structures. The second disposition is a horizontal flip of the first disposition. A corrected tilting shift is determined based on the first tilting shift and the second tilting shift.