Micro-sensor Flexible Circuit Board Wiring Elimination
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Solution Overview
Problem
The manufacturing of conventional micro-sensors is labor-consuming and time-consuming due to the need for forming wiring duct structures and connecting transmission lines to metal wires, which increases the volume and cost of the circuit substrate.
Innovation Solution
A micro-sensor design utilizing a flexible circuit board with a plastic layer exposing metal wires, where printed wires on a circuit substrate form direct electrical connections with the metal wires, eliminating the need for wiring duct structures and connecting wires, and incorporating a bridge board for signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring duct structures are formed on the circuit substrate and transmission lines are connected to metal wires, then electrical connections are established, but the manufacturing process becomes labor-consuming and time-consuming
Solution Approach 1:
The patent extracts and eliminates the wiring duct structures from the circuit substrate design. Instead of forming complex wiring ducts and connecting transmission lines, the invention directly exposes metal wires through openings in the insulating layer, allowing direct electrical connection between the circuit substrate and flexible circuit board, thereby simplifying the manufacturing process and improving productivity
Solution Approach 2:
The patent introduces an insulating layer with openings as an intermediary structure. This insulating layer serves as a mediator that both protects the metal wires and provides controlled access points for electrical connection, eliminating the need for complex wiring duct structures while maintaining reliable electrical connections
2Reliability
If wiring duct structures are formed on the circuit substrate, then electrical connections are established, but the volume of the circuit substrate increases
Solution Approach 1:
The patent removes the bulky wiring duct structures from the circuit substrate design. By directly exposing metal wires through openings in the insulating layer, the invention eliminates the need for three-dimensional wiring channels, thereby significantly reducing the volume of the circuit substrate while maintaining effective electrical connections
3Reliability
If wiring duct structures are formed and transmission lines are connected, then electrical connections are established, but additional auxiliary equipment is required for manufacturing
Solution Approach 1:
The patent extracts and eliminates the complex wiring duct formation process and transmission line connection steps. The simplified design requires only the formation of openings in the insulating layer and direct exposure of metal wires, eliminating the need for additional auxiliary equipment and complex manufacturing processes while ensuring reliable electrical connections
Data Source
AI summary
The micro-sensor for a micro image pick-up device includes a flexible circuit board and a circuit substrate. The flexible circuit board has an opening exposing an end of a plurality of metal wires. An image sensing device that electrically connected to a plurality of printed wires disposed on the circuit substrate. The circuit substrate is disposed at the opening of the flexible circuit board. The plurality of printed wires on the circuit substrate corresponds to and contacts the end of the plurality of metal wires exposed out of the flexible circuit board. With the design of the flexible circuit board, the steps of forming a plurality of wiring ducts on the circuit substrate and electrically connecting the printed wires of the circuit substrate by a plurality of connecting lines for transferring signals can be omitted.