Microserpentine Electrodes for Stretchable Biosensor Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing stretchable electronics using inorganic materials like silicon and aluminum face electrical failure due to mechanical deformation at small tensile strains, and there is a lack of understanding of 3D printed geometries for dynamic microelectrodes in stretchable and flexible devices.
Innovation Solution
Development of microserpentines with specific u-bend configurations and compositions, coated with conductive materials, integrated into a flexible package with PDMS insulation, optimized through 3D printing for enhanced flexibility and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inorganic materials like silicon and aluminum are used for microelectrodes, then electrical conductivity is maintained, but mechanical flexibility and stretchability are lost due to electrical failure at small tensile strains
Solution Approach 1:
The patent employs serpentine microelectrode geometries that function as flexible interconnects, allowing the rigid inorganic materials to be arranged in configurations that accommodate mechanical deformation. The serpentine shape acts as a flexible shell structure that can stretch and deform without causing electrical failure, resolving the contradiction between maintaining electrical conductivity and achieving mechanical flexibility.
Solution Approach 2:
The microelectrodes are designed with curved serpentine geometries instead of straight lines. These curved configurations allow the rigid inorganic materials to bend and deform elastically under tensile strain, preventing electrical failure while maintaining conductivity. The curvature enables the structure to adapt to mechanical deformation.
2Ease of manufacture
If standard straight wire geometries are used for microelectrodes, then manufacturing simplicity is maintained, but stretchability and flexibility are severely limited
Solution Approach 1:
The patent transforms straight wire geometries into serpentine curved shapes. This geometric transformation maintains compatibility with standard photolithography and deposition processes while dramatically enhancing stretchability. The curved serpentine pattern allows the microelectrodes to expand and deform without breaking, achieving both manufacturing simplicity and improved adaptability.
Solution Approach 2:
The serpentine microelectrode design segments the continuous conductive path into multiple bent sections. Each segment can independently deform under stress, allowing the overall structure to stretch while maintaining electrical continuity. This segmentation approach enables stretchability without complicating the manufacturing process.
3Adaptability or versatility
If 3D printing is used for microfabrication of complex shapes, then manufacturing flexibility and geometric complexity are enhanced, but understanding and optimization of dynamic stretchable geometries is lacking
Solution Approach 1:
The patent systematically varies geometric parameters of the serpentine microelectrodes, including the angle of completeness (α) of U-bends ranging from -35° to 45°, and the length-to-radius (l/R) ratio set to approximately 2. These parameter optimizations, achieved through 3D printing capabilities, enable precise control over stretchability while maintaining manufacturing feasibility and electrical performance.
Data Source
AI summary
Various embodiments relate to a microserpentine including a plurality of u-bends, each having a degree of completeness (α), in which an α value of 0° corresponds to a semi-circular shape, and in which an α value of +90° corresponds to a complete circle and −90° corresponds to a straight shape. Each of the plurality of u-bends may have an α value of from about −35° to about 45°. The microserpentine may include a core coated with a conductive coating. The core may include a polymeric material. Various embodiments relate to microelectronic devices and methods of producing the same. The microelectronic devices may include but are not limited to a microelectrode array, a microelectronics packaging, an interconnect, a stretchable sensor, a wearable sensor, a wearable actuator, an in vitro sensor, an in vivo sensor, and combinations thereof.