Microsized Optoelectronic Semiconductor Elements for High Resolution Displays
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Solution Overview
Problem
Conventional optoelectronic devices manufactured using LEDs require higher manufacturing accuracy and cost, leading to increased time and cost, and limited resolution due to larger LED sizes, which is not suitable for applications like VR or AR head-mounted displays.
Innovation Solution
An optoelectronic semiconductor device comprising microsized optoelectronic semiconductor elements with a side length between 1 μm and 100 μm, disposed on an epitaxial substrate, allowing for higher density and resolution, with a conducting circuit and photoluminescence layer, suitable for various applications including VR and AR displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional LEDs with side length greater than 100 μm are used in the manufacturing procedure, then the manufacturing process is simpler, but the resolution of the optoelectronic device is limited
Solution Approach 1:
The patent segments the conventional large LED into multiple microsized optoelectronic semiconductor elements (1-100 μm) that can be arranged in arrays on the epitaxial substrate. This segmentation enables higher resolution displays while maintaining a streamlined manufacturing process through direct epitaxial growth of multiple elements simultaneously.
2Manufacturing precision
If microsized optoelectronic semiconductor elements with side length 1-100 μm are used, then the resolution and density are improved, but the manufacturing accuracy requirement and cost increase
Solution Approach 1:
The patent merges multiple microsized optoelectronic semiconductor elements into a single integrated structure grown directly on the epitaxial substrate. This combining approach allows simultaneous fabrication of multiple high-precision elements in one manufacturing process, achieving high resolution without proportionally increasing manufacturing complexity or cost.
3Manufacturing precision
If conventional LED manufacturing procedure is used, then the manufacturing cost is lower for larger LEDs, but the manufacturing time increases for achieving high resolution
Solution Approach 1:
The patent performs preliminary action by directly growing multiple microsized optoelectronic semiconductor elements in their final high-density arrangement on the epitaxial substrate during the epitaxial process. This preliminary formation eliminates subsequent time-consuming steps of individual element fabrication, transfer, and assembly, thereby reducing manufacturing time while achieving high resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device reduces manufacturing time and cost while enabling higher resolution displays, such as VR or AR head-mounted displays, by utilizing microsized elements on an epitaxial substrate with improved density and accuracy.
Implementation Method 1
The microsized optoelectronic semiconductor elements include a light-emitting element and a light-receiving element
Implementation Method 2
When a second voltage is provided for the microsized optoelectronic semiconductor element, the microsized optoelectronic semiconductor element is a light-receiving element
Implementation Method 3
the optoelectronic semiconductor device further comprises a photoluminescence layer
Data Source
AI summary
An optoelectronic semiconductor device includes an epitaxial substrate and a plurality of microsized optoelectronic semiconductor elements. The microsized optoelectronic semiconductor elements are disposed separately and disposed on a surface of the epitaxial substrate. A length of a side of each of the microsized optoelectronic semiconductor elements is between 1 μm and 100 μm, and a minimum interval between two adjacent microsized optoelectronic semiconductor elements is 1 μm.