Microspring Array Chiplet for Hardware TPM
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Solution Overview
Problem
Existing hardware Trusted Platform Modules (TPMs) are inflexible and costly when integrated directly into chips, lacking the ability to be easily updated or replaced, which is a challenge in securing interconnected systems like IoT devices where emerging threats require frequent security upgrades.
Innovation Solution
A removable chiplet with a hardware TPM is used, connected via a dense microspring array to the information processing circuitry, allowing for high-bandwidth communication and easy replacement or upgrading without altering the underlying chip, thus separating the security function from the operation of the information processing circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hardware TPM is integrated directly into a chip, then security is improved, but flexibility and cost-effectiveness deteriorate
Solution Approach 1:
The patent divides the TPM functionality into a separate chiplet that can be independently manufactured and tested. This chiplet is then physically coupled to the information processing circuitry through a microspring array, allowing the security function to be segmented from the main processing unit. This segmentation enables independent updates and replacements of the TPM chiplet without affecting the main chip, thus improving flexibility while maintaining security.
2Reliability
If a hardware TPM is integrated directly into a chip, then security is improved, but manufacturing cost deteriorates
Solution Approach 1:
By segmenting the TPM into a separate chiplet, the patent enables independent manufacturing optimization. The chiplet can be produced using specialized processes for security functions while the main chip focuses on processing capabilities. This separate production pathway reduces overall manufacturing complexity and cost compared to integrating both functions into a single expensive chip.
Solution Approach 2:
The patent describes a chiplet design that can be coupled to different information processing circuits through a standardized interface (microspring array). This universal coupling mechanism allows a single TPM chiplet design to serve multiple different processing units, reducing the need for custom integration for each application and thereby lowering manufacturing costs.
3Adaptability or versatility
If a removable chiplet with microsprings is used, then flexibility is improved, but electrical connection reliability may worsen
Solution Approach 1:
The patent employs a microspring array that provides dynamic mechanical and electrical coupling between the chiplet and the main chip. The springs are designed to maintain optimal contact pressure while accommodating thermal expansion and manufacturing tolerances. This dynamic coupling mechanism ensures reliable electrical connections during normal operation and allows for easy insertion and removal without degradation of connection quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a cost-effective, highly secure TPM solution that can be shared across multiple devices, reducing the overall system cost and enabling rapid security updates without degrading system performance.
Implementation Method 1
An array of electrically conductive microsprings is disposed on a surface of the chiplet and is electrically coupled between the hardware trusted platform module and the contact pads
Implementation Method 2
An array of electrically conductive microsprings is disposed on a surface of the chiplet
Data Source
AI summary
A secured system includes at least one semiconductor chip comprising information processing circuitry. An array of contact pads is disposed on a surface of the chip and is electrically coupled to the information processing circuitry. The secured system includes one or more semiconductor chiplets. Each chiplet comprises at least a portion of at least one hardware trusted platform module that cryptographically secures the information processing circuitry. An array of electrically conductive microsprings is disposed on a surface of the chiplet and is electrically coupled between the hardware trusted platform module and the contact pads.