Micro-strand Heat Dissipation for Transceiver Thermal Management
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Solution Overview
Problem
Conventional transceiver devices, particularly silicon photonics transceiver devices, face challenges in dissipating high amounts of heat generated due to high circuit density and performance, leading to thermal issues such as disruption of optical data signals, component failures, and increased cooling costs.
Innovation Solution
The implementation of a micro-strand heat dissipation system within the transceiver device, featuring a plurality of micro-strand heat dissipator elements positioned in a spaced apart orientation, with each element having a first portion engaging transceiver components and a second portion extending from the components to dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional conduction through metal frame/chassis is used for heat dissipation, then the structure is simple and easy to manufacture, but the heat dissipation capability is insufficient for high-performance silicon photonics transceiver devices
Solution Approach 1:
The heat dissipation system is segmented into multiple micro-strand heat dissipator elements distributed across the transceiver device. Each micro-strand element independently conducts heat from specific high-heat-generation areas, dividing the heat dissipation function into multiple parallel pathways that collectively provide superior thermal management compared to a single conventional conduction path.
Solution Approach 2:
The micro-strand heat dissipator elements are strategically positioned to engage with specific transceiver components that generate high heat. This local placement ensures that heat is conducted away from critical high-heat-generation areas where it is most needed, rather than relying on general chassis conduction that distributes heat uniformly and less effectively.
2Reliability
If higher performance cooling components are used to dissipate heat, then the heat dissipation capability is improved, but the device complexity and cost increase
Solution Approach 1:
The micro-strand heat dissipator elements are integrated directly with the transceiver components, allowing the heat-generating components to serve their own cooling needs through direct thermal coupling. This self-service approach eliminates the need for separate, complex cooling systems while providing effective heat dissipation at the source.
Solution Approach 2:
The heat dissipation function is merged with the structural components of the transceiver device. The micro-strand heat dissipator elements are integrated into the existing device architecture, combining thermal management with the mechanical structure rather than adding separate cooling subsystems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables targeted and efficient heat dissipation from specific areas within the transceiver device, reducing thermal stress and the need for high-performance cooling components, thereby enhancing the reliability and efficiency of transceiver devices.
Implementation Method 1
Conventional transceiver devices rely the conduction of heat generated by (or via component coupled to) their circuit boards though the metal frame/chassis/"cage" of the transceiver device
Data Source
AI summary
A micro-strand transceiver device heat dissipation system includes a transceiver device chassis, at least one transceiver component located in the transceiver device chassis, and micro-strand heat dissipator elements that are each positioned in the transceiver device chassis in a spaced apart orientation from the others of the micro-strand heat dissipator elements. Each of the micro-strand heat dissipator elements include a first micro-strand heat dissipator element portion that engages the at least one transceiver component, and a second micro-strand heat dissipator element portion that extends from the at least one transceiver component. The first micro-strand heat dissipator element portion on each of the micro-strand heat dissipator elements conducts heat generated by the at least one transceiver component to the second micro-strand heat dissipator element portion on that micro-strand heat dissipator element, which allows that heat to be dissipated.