Microstrip Patch Antenna Array Layout for Wider Bandwidth
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Solution Overview
Problem
Existing microstrip patch antenna arrays face limitations in bandwidth and manufacturing cost, particularly in high-frequency applications, and struggle to efficiently couple radiating patches, leading to reduced gain and increased grating lobe formation.
Innovation Solution
The use of a thin substrate with strategically positioned parasitic patches and Via connections between the conducting metal and ground plane enhances coupling between radiating patches, increasing bandwidth by 50% or more, while maintaining structural flexibility and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If conventional microstrip patch antenna arrays are used, then manufacturing cost is low and fabrication is simple, but bandwidth is limited and coupling between radiating patches is insufficient
Solution Approach 1:
The patent introduces parasitic patches positioned between radiating patches to enhance coupling. These intermediate elements create additional coupling paths and modify the electromagnetic field distribution, effectively adding a dimensional aspect to the coupling mechanism that increases bandwidth without fundamentally changing the basic microstrip patch structure
Solution Approach 2:
Parasitic patches serve as intermediary elements between radiating patches, facilitating enhanced coupling through electromagnetic interaction. These parasitic elements mediate the energy transfer between adjacent radiating patches, increasing coupling efficiency and bandwidth while maintaining the overall array structure
2Strength
If thicker substrates are used for patch antenna arrays, then structural rigidity is improved, but manufacturing cost increases and flexibility is reduced
Solution Approach 1:
The patent successfully implements a thin substrate design that provides adequate structural support while enabling flexibility and reducing manufacturing costs. The thin substrate approach is made viable through the strategic placement of parasitic patches that enhance coupling efficiency, demonstrating that structural requirements can be met without sacrificing the benefits of thin-film construction
3Duration of action of moving object
If parasitic patches are added to enhance coupling, then bandwidth increases, but manufacturing complexity and cost increase
Solution Approach 1:
The antenna array is segmented into radiating patches and parasitic patches with distinct functional roles. This segmentation allows for optimized coupling between elements while maintaining manufacturing simplicity, as each segment can be designed and fabricated using standard microstrip techniques
Solution Approach 2:
The parasitic patches are integrated into the same substrate and fabrication process as the radiating patches, combining multiple functions into a single manufacturing step. This merging approach increases bandwidth while avoiding the need for separate assembly processes, thereby limiting the increase in manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases the bandwidth of the microstrip patch antenna array, enhances structural flexibility, and reduces manufacturing costs, while maintaining acceptable gain levels and minimizing grating lobe formation.
Implementation Method 1
Via connections between the conducting metal and ground plane enhances coupling between radiating patches
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
A microstrip antenna array (200; 300; 400) comprising: a thin substrate (204); two or more microstrip radiating patches (202; 302; 402) placed on a first side (208) of the substrate (204), each radiating patch (202; 302; 402) comprising: an input port (210); a radiating patch width (WRP) extending in a longitudinal direction; a radiating patch length (LRP) extending in a transverse direction, wherein the transverse direction is perpendicular to the longitudinal direction, and wherein the longitudinal and transverse directions are in the plane of the radiating patch; a radiating patch transverse axis (TRP) along the midpoint of the radiating patch width; and a radiating patch longitudinal axis along the midpoint of the radiating patch length, wherein the two or more radiating patches are spaced in the longitudinal direction such that the radiating patch longitudinal axis of each radiating patch is aligned along a common longitudinal axis (C); and one or more parasitic patches (212; 312; 412) placed on the first side (208) of the substrate (204), wherein there is at least one fewer parasitic patches than there are radiating patches, each parasitic patch comprising: a parasitic patch width (WPP) extending in the longitudinal direction; a parasitic patch length (LPP) extending in the transverse direction; a parasitic patch transverse axis (TPP) along the midpoint of the parasitic patch width; and a parasitic patch longitudinal axis along the midpoint of the parasitic patch length, wherein the one or more parasitic patches (212; 312; 412) are spaced in the longitudinal direction such that the parasitic patch longitudinal axis of each parasitic patch is aligned along the common longitudinal axis (C), wherein each parasitic patch is positioned between two radiating patches (202; 302; 402), and wherein the parasitic patch transverse axis (TPP) of each parasitic patch is positioned at the midpoint between the radiating patch transverse axes (TRP) of the two radiating patches either side of each parasitic patch.