Microstrip Collinear Array Antenna Miniaturization

The patent transitions from a conventional linear arrangement of planar antennas along the carrier board length to a three-dimensional collinear array structure where multiple antenna assemblies are stacked vertically and connected via extending lines. This spatial reconfiguration allows the antennas to be arranged in a collinear fashion along the vertical axis rather than horizontally along the carrier board, thereby achieving high peak gain without increasing the carrier board length.

The patent employs a nested structure where multiple antenna assemblies are stacked one above another on the carrier board, with each assembly containing multiple planar antennas. The extending lines connect corresponding antennas across different assemblies, creating a compact nested configuration that packs more antennas into a smaller horizontal footprint while maintaining the collinear radiation pattern.

The patent reconfigures the antenna array from a horizontal linear arrangement to a vertical three-dimensional structure. By stacking antenna assemblies vertically and using extending lines to connect corresponding elements, the collinear array achieves its radiation pattern along the vertical axis, effectively reducing the horizontal overall length of the antenna module while maintaining high peak gain.

The patent combines multiple antenna assemblies into a single integrated collinear array structure. The extending lines merge the radiation patterns of corresponding antennas from different assemblies, creating a unified collinear array that achieves high peak gain through constructive interference while occupying a compact overall length.