Semiconductor Device Microstrip Line Impedance Balancing
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Solution Overview
Problem
In semiconductor devices, uneven operations of transistor cells due to differences in load impedances caused by mutual inductances between bonding wires lead to deterioration in characteristics and oscillation, which existing methods struggle to address effectively without altering the shape or length of the wires.
Innovation Solution
The semiconductor device incorporates first microstrip lines connected to circuit patterns on both sides that are longer than others, ensuring even load impedances without changing the bonding wire shapes, thereby balancing inductances and suppressing oscillation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the lengths of bonding wires are adjusted to compensate for mutual inductance differences, then load impedance evenness improves, but wire height increases and manufacturing complexity increases
Solution Approach 1:
The patent segments the impedance matching function into two parts: the bonding wire provides the primary connection, while a separate microstrip line segment provides the additional inductance needed for impedance matching. This allows the bonding wire itself to maintain its standard height and shape without modification.
Solution Approach 2:
The patent introduces a microstrip line as an intermediary element between the bonding wire and the transistor cell. This microstrip line acts as a mediator that provides the necessary inductance to balance load impedances without requiring the bonding wire itself to be modified in height or shape.
2Manufacturing precision
If the number or thicknesses of bonding wires are changed to adjust inductance, then inductance values change, but inductance optimization becomes difficult due to discrete changes
Solution Approach 1:
The patent changes the parameter of the microstrip line (its length) to continuously adjust the inductance value. Unlike discrete changes in wire number or thickness, the microstrip line length can be precisely controlled to achieve the exact inductance value needed for optimal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively balances load impedances, improving saturated output power, efficiency, and gain while reducing production costs by maintaining wire lengths and widths, thus optimizing the design without increasing substrate size.
Implementation Method 1
impedance transforming using bonding wires' inductance components can realize a small-sized circuit and low costs
Implementation Method 2
impedance transforming using bonding wires' inductance components can realize a small-sized circuit and low costs
Data Source
AI summary
In a circuit substrate, a plurality of first microstrip lines connect outputs of a plurality of circuit patterns containing a parallel capacitor to a plurality of first output pads respectively. A plurality of second wires connect the first output pads of the circuit substrate to inputs of a plurality of transistor cells of a semiconductor substrate respectively. The numbers of the fingers of the transistor cells are the same. The first microstrip lines connected to the circuit patterns disposed on both sides of the lining-up circuit patterns are longer than the other first microstrip lines.