Microstrip-to-Suspended Line Transition for Lower RF Connection Loss
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Solution Overview
Problem
The existing connection between microstrip and suspended lines in high-frequency circuits experiences significant loss due to abrupt changes in electric field distribution and transmission mode.
Innovation Solution
A high-frequency circuit design that includes a connector with a connected conductor widening gradually from a microstrip line to a suspended line, maintaining consistent impedance and electric field distribution, reducing transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a connector connects microstrip line and suspended line, then signal transmission between different transmission lines is enabled, but transmission loss increases due to abrupt electric field distribution changes
Solution Approach 1:
The connected conductor is designed with a dynamic width that gradually changes from the first end to the second end, transitioning from a narrower width at the microstrip line connection to a wider width at the suspended line connection. This gradual width change enables smooth electric field distribution transition, reducing reflection and transmission loss while maintaining signal transmission compatibility between different transmission line types.
Solution Approach 2:
The connector utilizes parameter changes in the connected conductor's geometric dimensions, specifically the width parameter that gradually increases from first end to second end. This parameter variation creates a tapered transition structure that smoothly transforms the electric field distribution characteristics, thereby reducing transmission loss while enabling signal transmission between microstrip and suspended lines.
2Ease of manufacture
If the connected conductor width is uniform, then manufacturing is simplified, but electric field distribution changes abruptly causing high transmission loss
Solution Approach 1:
The connected conductor employs a dynamic width design that gradually changes along its length rather than maintaining a uniform width. This tapered configuration smoothly transitions the electric field distribution between microstrip and suspended lines, significantly reducing transmission loss while remaining manufacturable through standard PCB fabrication techniques.
Solution Approach 2:
The connector implements parameter changes in the connected conductor's width dimension, transitioning from a narrower width at the microstrip interface to a wider width at the suspended line interface. This gradual parameter variation optimizes electric field distribution and minimizes transmission loss without significantly complicating the manufacturing process.
3Stability of the object's composition
If the distance between dielectric substrate and metal layer is constant, then structural stability is maintained, but impedance matching deteriorates causing signal reflection
Solution Approach 1:
The distance between the dielectric substrate and metal layer in the connected conductor is designed to gradually change from the first end to the second end, creating a dynamic spacing profile. This gradual distance variation enables smooth impedance transformation and electric field distribution transition, improving impedance matching and reducing signal reflection while maintaining overall structural stability.
Solution Approach 2:
The connector utilizes parameter changes in the spacing distance between the dielectric substrate and metal layer, with the distance gradually increasing from the first end toward the second end. This parameter variation optimizes impedance matching across the transition region, reducing signal reflection and improving transmission reliability while preserving structural integrity.
Data Source
AI summary
A high frequency circuit and radar device is disclosed. The high frequency circuit includes a microstrip line (MSL), a suspended line (SML), and a connector (MTP). The MSL includes a dielectric substrate having opposing first surfaces and second surfaces, a first signal conductor arranged on the first surface, and a ground conductor arranged on the second surface. The SML includes a dielectric substrate, a second signal conductor arranged on the first surface, and a metal housing arranged from the second surface through a cavity. The MTP includes a dielectric substrate, a signal conductor connecting the first signal conductor and the second signal conductor, and a metal housing arranged from the second surface through a lower cavity. The height of the lower cavity gradually increases from the first end to the second end.