Microstrip-to-waveguide transition for adjustable bandwidth
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Solution Overview
Problem
Conventional copper interconnects in wired communications face limitations due to attenuation caused by the skin effect, leading to increased power and cost penalties as data rate and transmission distance increase, necessitating a more efficient bandwidth utilization method.
Innovation Solution
A microstrip circuit coupled with a dielectric waveguide and microstrip-to-waveguide transition (MWT) that adjusts the bandwidth of a frequency band to transmit a wideband signal with minimized reflection and radiation losses, enabling effective data transmission with a wider bandwidth compared to dual sideband demodulation schemes and RF wireless techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional copper interconnects are used for wired communications, then the system can transmit data signals, but attenuation due to skin effect increases with data rate and transmission distance, leading to increased power and cost penalties
Solution Approach 1:
The patent replaces conventional copper electrical interconnects with an optical communication system using light sources (laser or LED), optical waveguides, and photodetectors. This substitution of electrical signals with optical signals eliminates skin effect attenuation, enabling high data rates over long distances without exponential power penalties.
Solution Approach 2:
The patent changes the fundamental transmission parameter from electrical signals to optical signals. By using light frequency carriers and optical modulation techniques, the system achieves vastly superior bandwidth and reduced attenuation compared to electrical copper interconnects, directly resolving the contradiction between data rate and energy loss.
2Ease of manufacture
If conventional copper interconnects are used, then the system can operate at lower costs initially, but power penalties increase exponentially with transmission distance and data rate
Solution Approach 1:
The patent substitutes electrical signal transmission with optical signal transmission through integrated optical components. This replacement fundamentally changes the energy efficiency characteristics, as optical signals do not suffer from resistive losses and skin effect, thereby reducing power consumption exponentially with distance compared to copper interconnects.
3Productivity
If a microstrip circuit is used with a waveguide, then bandwidth is doubled compared to dual sideband demodulation, but the system complexity increases with additional components like probe elements and slotted ground planes
Solution Approach 1:
The patent transitions from planar microstrip transmission to three-dimensional waveguide structures. This dimensional change enables single-sideband operation and doubled bandwidth utilization by exploiting the vertical dimension and waveguide mode characteristics, while the integrated design keeps complexity manageable.
Solution Approach 2:
The patent introduces a microstrip-to-waveguide transition structure as an intermediary component that efficiently couples the planar microstrip line to the three-dimensional waveguide. This transition structure, including probe elements and slotted ground planes, enables bandwidth expansion while managing the complexity through standardized interface design.
4Loss of energy
If the waveguide encloses a dielectric with metal cladding, then radiation losses and channel losses are reduced, but the manufacturing complexity and material requirements increase
Solution Approach 1:
The patent employs thin metal cladding layers enclosing the dielectric waveguide core. This shell structure effectively contains the optical mode, reducing radiation losses and channel losses. The thin-film cladding approach balances manufacturing feasibility with effective loss reduction, avoiding excessive complexity while achieving superior signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a transmission signal close to a single sideband signal, utilizing a bandwidth twice as wide as dual sideband demodulation schemes and achieving high-speed data communication with reduced channel losses and power consumption, while maintaining low cost and minimizing interference.
Implementation Method 1
a dielectric waveguide having a metal cladding and connected to the microstrip circuit
Implementation Method 2
transmits a signal from a board on the side of a transmitter to a board on the side of a receiver
Implementation Method 3
a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT)
Implementation Method 4
The waveguide may reduce radiation losses and channel losses by enclosing a dielectric with a metal cladding
Data Source
AI summary
Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.