Microstructure Transfer Using Elastic Sticky-Layer Peeling
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Solution Overview
Problem
Existing transfer methods for micro structures, such as micro LEDs and microchips, face challenges in evenly irradiating laser light due to focal position adjustments and plastic deformation like warpage or roughness, leading to irradiation unevenness, peeling failures, and damage to devices.
Innovation Solution
A transfer apparatus with a first plate-like member detachably holding micro structures via a temporary adhesion layer and a second plate-like member with an elastically deformable sticky layer, where a pressure part ensures the layers are parallel, and a denaturing/peeling part reduces the adhesion layer's force, allowing controlled embedding and peeling of micro structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser light is irradiated to the separation layer to change its properties, then the supporting body can be separated from the laminated body, but irradiation unevenness occurs due to focal position adjustment difficulties and plastic deformation, leading to peeling failures or device damage
Solution Approach 1:
The patent applies preliminary action by pressing the micro structures into the sticky layer before laser irradiation. This pre-embedding step ensures that even if irradiation unevenness occurs during separation, the micro structures are already positioned and protected, preventing peeling failures and device damage while maintaining separation reliability
Solution Approach 2:
The patent implements beforehand cushioning by using the elastically deformable sticky layer to absorb and distribute stress during laser irradiation. The sticky layer acts as a cushion that protects the micro structures from shock waves and thermal stress, preventing fractures and damage even when irradiation is not perfectly uniform
2Manufacturing precision
If the laser beam shape is limited by a beam homogenizer, then uniform irradiation can be achieved, but the device complexity increases and the process becomes more difficult to adjust
Solution Approach 1:
The patent uses the sticky layer as an intermediary between the laser beam and the micro structures. Instead of modifying the laser beam itself with complex homogenizers, the sticky layer mediates the energy distribution, providing uniform separation effects through its elastic deformation and stress distribution properties, thereby simplifying the overall system
Solution Approach 2:
The patent changes the physical state and properties of the sticky layer through controlled heating during laser irradiation. By changing the temperature and mechanical properties of the sticky layer, uniform separation is achieved without requiring complex beam homogenization equipment, reducing device complexity while maintaining manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures even transfer and peeling of micro structures without irradiation unevenness, preventing device damage and improving yield by embedding micro structures in the sticky layer, regardless of plastic deformation, and reducing the need for beam homogenizers.
Implementation Method 1
a denaturing/peeling part which changes a property of the temporary adhesion layer such that an adhesive force of the temporary adhesion layer is reduced
Implementation Method 2
In the light irradiation process, by repeating a light irradiation step of irradiating laser light to each divided area
Data Source
AI summary
A transfer apparatus includes the first plate-like member in which the micro structures are detachably held via the temporary adhesion layer, the second plate-like member having a sticky layer which faces the first plate-like member and is elastically deformable in a thickness direction, a pressure part which presses one of the first plate-like member and the second plate-like member toward another one of the first plate-like member and the second plate-like member in the thickness direction such that the temporary adhesion layer and the sticky layer become parallel to each other at least locally, a denaturing/peeling part which changes properties of the temporary adhesion layer such that an adhesive force of the temporary adhesion layer is reduced, and a controlling part which controls operations of the pressure part and the denaturing/peeling part.