Microstructure Vapor Chamber for Thin Heat Dissipation
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Solution Overview
Problem
Conventional vapor chambers are too thick and unable to meet the requirements for thinness and lightweight in electronic devices, leading to inefficiencies in heat dissipation due to increased vapor resistance and potential for liquid droplets to gather and not return to the evaporation region.
Innovation Solution
A vapor chamber design featuring a microstructure layer on the inner surfaces and capillary structure to enhance wettability and capillary performance, allowing for timely return of liquid-phase working medium from the condensation region to the evaporation region, reducing vapor resistance, and preventing droplet accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional vapor chamber structure is used, then heat dissipation function is provided, but thickness is too large to meet thinness requirements
Solution Approach 1:
The patent applies thin film structures by reducing the thickness of plate covers and utilizing microstructure layers on inner surfaces to achieve the desired thinness while maintaining heat dissipation functionality through optimized capillary wick structures
Solution Approach 2:
The patent employs porous microstructure layers on the inner surfaces of plate covers and within capillary structures to enhance capillary action for liquid working medium return, enabling effective heat dissipation in a reduced thickness configuration
2Length of moving object
If vapor chamber thickness is reduced, then thinness requirement is met, but vapor resistance increases affecting heat dissipation efficiency
Solution Approach 1:
The patent optimizes geometric parameters of the vapor chamber including vapor channel dimensions, capillary structure configuration, and microstructure layer characteristics to minimize vapor resistance while maintaining reduced overall thickness
3Productivity
If liquid-phase working medium returns timely to evaporation region, then heat dissipation efficiency is improved, but liquid droplets may accumulate in condensation region
Solution Approach 1:
The patent utilizes porous microstructure layers on inner surfaces and within capillary structures to enhance capillary wick action, enabling reliable liquid-phase working medium return from condensation region to evaporation region while preventing droplet accumulation through optimized pore structures
Solution Approach 2:
The patent leverages phase transition mechanisms of the working medium between liquid and vapor phases, combined with capillary forces in microstructure layers, to ensure continuous and reliable liquid return flow that prevents accumulation while maintaining high heat dissipation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vapor chamber effectively improves heat dissipation by ensuring timely return of the liquid-phase working medium, maintaining temperature uniformity, and preventing droplet-related issues, thus enhancing the thermal performance and reliability of electronic devices.
Implementation Method 1
a liquid-phase working medium in a condensation region returns to an evaporation region on the vapor chamber after being guided by the microstructure layer
Implementation Method 2
A vapor chamber design featuring a microstructure layer on the inner surfaces and capillary structure to enhance wettability and capillary performance
Implementation Method 3
the vapor chamber can implement timely return of the liquid-phase working medium in the condensation region, and improve a problem that liquid droplets gather in the condensation region
Data Source
AI summary
A vapor chamber is provided. The vapor chamber includes a first and a second plate cover, and a capillary structure, where the first and the second plate cover form an accommodating cavity. Capillary structures are in a shape of a long strip, and are arranged at intervals in the accommodating cavity in parallel. Two opposite surfaces of the capillary structure are respectively connected to the first and the second plate cover, to support the first plate cover and the second plate cover in an overlapping direction of the first plate cover and the second plate cover. A vapor channel is formed around the capillary structure filled with a working medium. The microstructure layer is introduced to an inner surface of the accommodating cavity and the capillary structure in the vapor chamber. In the vapor chamber, the liquid-phase working medium in the condensation region can return in time.