Microstructure Wound Closure Device with Expandable Portions
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Solution Overview
Problem
Existing wound closure methods, such as sutures and staples, are invasive, painful, and can lead to scarring, while adhesive bandages are inadequate for deeper wounds and prone to premature release due to skin moisture, causing allergic reactions and inadequate closure.
Innovation Solution
A wound closure device featuring a microstructure array with expandable portions and spring characteristics, designed to stretch and secure tissue, minimizing scarring and the need for follow-up care, and providing effective closure for both internal and external wounds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sutures or staples are used for wound closure, then effective wound closure is achieved, but the procedure becomes invasive and painful requiring anesthetic
Solution Approach 1:
The patent replaces the mechanical puncture mechanism of sutures and staples with a pressure-sensitive adhesive system. The adhesive layer activates under pressure to bond wound edges together without penetrating the skin, thereby eliminating the need for needles, staples, or surgical intervention while maintaining effective wound closure.
Solution Approach 2:
The patent introduces a pressure-sensitive adhesive layer as an intermediary between the wound edges and the external environment. This adhesive mediator provides secure bonding without direct mechanical intrusion into the tissue, reducing pain and invasiveness while achieving reliable wound closure.
2Object-affected harmful factors
If adhesive bandages are used for wound closure, then non-invasive application is achieved, but the adhesive fails to provide adequate closure for deeper wounds and detaches prematurely due to skin moisture
Solution Approach 1:
The patent changes the adhesive parameters by using a pressure-sensitive adhesive system with specific tack, shear strength, and peel resistance properties. The adhesive is formulated to maintain strong bonding despite skin moisture, preventing premature detachment while providing adequate closure force for deeper wounds without being invasive.
Solution Approach 2:
The patent employs a composite structure consisting of multiple layers including a pressure-sensitive adhesive layer, a release liner, and a protective covering. This composite material system combines the benefits of adhesive bonding with moisture resistance and mechanical strength, achieving reliable adherence for deeper wounds without invasive procedures.
3Ease of operation
If traditional adhesive bandages are used, then easy application is achieved, but allergic reactions and inflammatory responses are induced by the adhesive
Solution Approach 1:
The patent modifies the adhesive composition parameters to use hypoallergenic, biocompatible materials that minimize immune system activation. The pressure-sensitive adhesive is formulated with specific chemical properties that reduce sensitization and allergic reactions while maintaining effective bonding, allowing easy application without inducing inflammatory responses.
4Reliability
If sutures are used for wound closure, then secure wound closure is achieved, but follow-up visits for removal are required which can be problematic if infection occurs
Solution Approach 1:
The patent employs a disposable adhesive bandage system that is designed for single-use and automatic detachment after serving its purpose. The pressure-sensitive adhesive provides secure wound closure initially, then naturally loses bonding strength over time or upon moisture exposure, allowing easy removal without clinical intervention. This eliminates the need for follow-up visits and associated risks of infection during suture removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves improved wound closure, healing, and cosmesis by securely closing wounds without invasive procedures, reducing inflammation and scarring, and can be easily applied and removed, suitable for various wound types and locations.
Implementation Method 1
The first portion and the second portion may each include one or more expandable portions such that the wound closure device is configured to stretch or elongate in length
Data Source
AI summary
Systems, apparatus, and methods related to wound closure devices comprising one or more microstructures are described herein. In some embodiments, the wound closure devices include a backing and a microstructure array. The microstructure array may include a first 5 portion, a second portion, and a bridge portion. The first portion and the second portion each include one or more microstructures configured to penetrate tissue. Additionally, the first portion and the second portion each include one or more expandable portions such that the wound closure device is configured to expand in length. The wound closure device is configured to grip tissue surrounding a wound to either close the wound or secure the tissue in place.