Microstructured Interconnects for Modular Chip Assembly
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Solution Overview
Problem
Current electronic and electromechanical systems face challenges in modularity and rework due to size, performance, and mechanical requirements, particularly in high-value components where integration density, size, weight, yield, and cost are limiting factors, and existing interconnect technologies struggle with precision, alignment, and thermal management.
Innovation Solution
The development of mechanical structures with snap-together features and precision tolerancing in microstructured metals and dielectrics for planar subsystems, allowing for elastic deformation during interconnection while maintaining connection force, along with 'dry' planar subsystem to chip interconnects that enable bare die insertion and removal without rework, and the use of precision fabrication techniques for controlled solder joints and alignment features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If integrated circuit technology is used to push functionality into densely integrated chips, then device size is reduced and performance is improved, but modularity is lost and rework becomes impossible
Solution Approach 1:
The patent divides the electronic system into separate functional modules (chips, substrates, interconnects) that can be independently fabricated, tested, and assembled. This segmentation allows high-density integration within each module while maintaining system-level modularity through standardized interfaces and reversible bonding techniques.
2Productivity
If permanent attachment of chips is used to achieve high integration density, then assembly speed is improved, but rework and repair become too complicated
Solution Approach 1:
The patent employs dynamic bonding techniques that transition from temporary mechanical attachment during assembly to permanent chemical bonding after alignment. This allows rapid initial assembly with rework capability, followed by stabilization that maintains the connection while enabling future replacement if needed.
3Temperature
If thermal conduction through heat pipes and thermal busses is used, then thermal management is improved, but modularity becomes a challenge
Solution Approach 1:
The patent implements localized thermal management solutions where each module contains its own heat dissipation structures (heat sinks, thermal vias, conductive paths) optimized for its specific thermal load. This allows effective heat management at the component level while maintaining system-level modularity through standardized mechanical and electrical interfaces.
4Temperature
If forced air cooling with multiple fans is used, then heat removal capability is improved, but system complexity and size increase
Solution Approach 1:
The patent replaces active mechanical cooling systems (fans, pumps) with passive thermal conduction and convection structures integrated into the substrate and interconnect layers. This includes thermally conductive materials, heat spreaders, and naturally convecting heat sinks that eliminate moving parts while maintaining effective heat removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables systems with desired modularity and high performance, reducing size, mass, and form factor while improving assembly speed and reducing unnecessary bulk and cost, with enhanced thermal management and precision alignment, allowing for easy replacement of high-value components.
Implementation Method 1
by a deliberate design and tolerancing of elements disposed therein to create snap-together features that may elastically deform during the interconnection process and still maintain sufficient connection force after being joined
Implementation Method 2
The solder joints may be used to attach the microstructure to a substrate or to each other
Implementation Method 3
provide a spring force or clamping force within the microstructured metals and/or dielectrics by a deliberate design and tolerancing of elements disposed therein to create snap-together features
Data Source
AI summary
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.