Microstructured Carrier Sheet for Reversible Component Carrier Bonding
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Solution Overview
Problem
Component carriers face challenges in heat dissipation and mechanical robustness, electrical reliability, and proper adhesion, particularly with increasing miniaturization and the need for both adhesive and repellent properties in electronic components.
Innovation Solution
A method involving sheets with nano- and/or microstructures that can be integrated into component carriers to provide adjustable adhesive or repellent properties, allowing for dry adhesion or release functions without the need for liquids, enhancing mechanical and electrical connectivity while preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesive methods are used to bond layers in component carriers, then adhesion between layers is achieved, but delamination occurs under thermal and mechanical stress
Solution Approach 1:
The patent changes the physical-chemical parameters of the adhesive layer by incorporating silane coupling agents that form chemical bonds with both the substrate and the adhesive. This chemical bonding mechanism fundamentally alters the adhesion parameters, transforming physical adhesion into chemically bonded adhesion that resists delamination under thermal and mechanical stress.
Solution Approach 2:
The patent uses composite material structures by combining organic adhesive materials with inorganic silane coupling agents. This composite approach creates a multi-functional adhesive system that provides both the bonding characteristics of organic materials and the thermal stability and chemical bonding capability of inorganic silanes, thereby preventing delamination.
2Adaptability or versatility
If release layers are added to enable cavity formation, then repellent property is achieved, but device complexity increases
Solution Approach 1:
The patent makes the adhesive layer multi-functional by enabling it to perform both adhesion and release functions. By controlling the curing conditions and silane content, the same layer can be made adhesive or repellent as needed, eliminating the need for separate dedicated release layers and simplifying the overall device structure.
Solution Approach 2:
The patent introduces dynamic controllability to the adhesive layer's surface properties. The layer can dynamically switch between adhesive and repellent states by adjusting curing parameters, silane concentration, or processing conditions, allowing the same material to adapt to different functional requirements without adding structural complexity.
3Productivity
If miniaturization of electronic components is pursued, then product functionality increases, but heat dissipation becomes more difficult
Solution Approach 1:
The patent changes the thermal parameters of the adhesive layer by selecting materials with high thermal conductivity and incorporating thermally conductive fillers. This modifies the heat transfer parameters, enabling efficient heat dissipation from miniaturized components even at high component densities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the reliability and flexibility of component carriers by enabling efficient heat dissipation, mechanical robustness, and precise surface properties, reducing the risk of delamination and contamination, and allowing for reversible connections and cavity formation.
Implementation Method 1
The sheet with nano- and/or microstructures is connected together with the carrier plate to form a temporary carrier, which is connected to the stack due to a dry adhering configuration of the nano- and/or microstructures
Implementation Method 2
Depending on the material, shape, dimension, coating and arrangement of the nano- and/or microstructures on the sheet surface, the nano- and/or microstructures may have an adhesive effect (such as at a leg of a gecko) or a repellent effect (such as on a surface of a lotus flower)
Data Source
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Figure 3
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AI summary
A method of using a sheet (100) with nano- and/or microstructures (102) on a sheet surface (104) for manufacturing a component carrier (106).