Microstructured Vacuum Holder for Flat, Uniform Substrate Exposure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional vacuum-based substrate holders cause undesirable compression and bending of substrates with low rigidity and lead to intensity variations in light transmission, resulting in unacceptable "coloring effects" during manufacturing of micro- and nanostructured devices.
Innovation Solution
A component with a base body featuring a close-meshed arrangement of micro- or nanostructures and trenches with a statistical distribution, allowing for planar vacuum suction without substrate deformation and homogeneous exposure, where the trenches provide the necessary vacuum and minimize light interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vacuum grooves are used, then vacuum holding is achieved, but substrate compression and bending occur
Solution Approach 1:
The continuous vacuum groove is segmented into multiple discrete micro- or nanostructures (pins, pillars, or posts) distributed across the substrate holder surface. This segmentation reduces the continuous contact area that causes substrate bending while maintaining effective vacuum holding through distributed suction points.
Solution Approach 2:
The vacuum holding function is localized to specific discrete points (micro- or nanostructures) rather than being distributed continuously. This allows the substrate to maintain flatness in between the localized vacuum contact points while still achieving reliable holding at the structured locations.
2Shape
If narrow vacuum grooves are used, then substrate deformation is reduced, but light transmission homogeneity deteriorates
Solution Approach 1:
The dimensions of the vacuum structures are changed from millimeter-scale grooves to micro- or nano-scale structures. This parameter change reduces the impact on light transmission while maintaining vacuum holding capability, as the smaller structures create less optical interference and allow more uniform light passage.
Solution Approach 2:
The substrate holder employs a composite structure combining transparent or translucent material with integrated micro- or nanostructures. This allows the holder to simultaneously provide mechanical support and vacuum holding functions while maintaining optical transparency for homogeneous light transmission during exposure processes.
3Shape
If sandblasted surface is used, then planar vacuum and homogeneous exposure are achieved, but surface roughness increases
Solution Approach 1:
Instead of using a sandblasted rough surface for vacuum holding, the invention segments the surface into defined micro- or nanostructures with controlled geometries. This provides precise control over surface topology, achieving planar vacuum contact without the uncontrolled high roughness associated with sandblasting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The component ensures secure holding and flat positioning of substrates without bending, while providing homogeneous exposure and minimizing light scattering effects, thus preventing substrate deformation and ensuring uniform illumination.
Implementation Method 1
to which a vacuum can be applied
Implementation Method 2
The vacuum required for this is provided by the trenches
Implementation Method 3
Owing to their statistical distribution, any interfering scattering effects and/or incoherent superposition effects when light passes through the component are avoided
Data Source
AI summary
Disclosed is a component for manufacturing micro- and/or nanostructured devices. The component has a base body and a surface which has micro- or nanostructures which form a substantially flat support surface, and between which trenches extend with a statistical distribution, to which a vacuum can be applied. Also disclosed is a method of manufacturing such a component.