Sub-millimeter Microsystem Packaging for Harsh Environments
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Solution Overview
Problem
Microsystem packaging for harsh environments, such as oil exploration, faces challenges in withstanding high pressures, temperatures, and corrosive fluids, limiting their use in subterranean applications due to size constraints and inadequate protection.
Innovation Solution
A method of packaging microsystems using a micropackage structure with a metal and non-metallic combination, where the micropackage portions are configured to deform and seal the microsystem in a cavity, allowing for hermetic sealing and external communication, and coated with alumina and poly(p-xylylene) for corrosion resistance, enabling the microsystems to withstand extreme conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If microsystems are packaged using standard integrated circuit packaging techniques, then manufacturing cost is reduced and ease of manufacture is improved, but the packaging cannot withstand harsh environments such as high pressure, high temperature, and corrosive fluids
Solution Approach 1:
The micropackage is divided into two separate portions (first micropackage portion and second micropackage portion) that are attached to opposite sides of the microsystem. This segmentation allows each portion to be optimized for specific functions (e.g., one side for environmental protection, the other for sensing) and enables parallel processing during manufacturing, improving both reliability and ease of manufacture.
Solution Approach 2:
The microsystem is nested within a cavity formed between the first and second micropackage portions. The micropackage portions are attached to the substrate in a nested configuration where the cavity contains the microsystem, creating a compact structure that maximizes protection while minimizing overall size and manufacturing complexity.
2Adaptability or versatility
If the micropackage size is reduced to 1 mm or less to meet size constraints, then adaptability to harsh subterranean environments is improved, but the structural integrity and sealing capability become more difficult to maintain
Solution Approach 1:
The bonding interface between the first and second micropackage portions is designed with enhanced local quality features such as increased bonding surface area, optimized bonding material distribution, and reinforced sealing structures at critical locations. This allows the micropackage to achieve hermetic sealing and maintain structural integrity at the reduced 1 mm scale, enabling adaptability to harsh environments while preserving sealing capability.
3Reliability
If hermetic sealing is implemented to protect against corrosion and pressure, then reliability in harsh environments is improved, but the device complexity increases due to additional sealing mechanisms
Solution Approach 1:
The hermetic sealing function is extracted and integrated directly into the micropackage portions themselves rather than requiring separate sealing mechanisms. The first and second micropackage portions are designed with built-in sealing features at their bonding interfaces, eliminating the need for additional sealing components and reducing overall device complexity while maintaining reliable protection against corrosion and pressure.
4Strength
If the micropackage portions are made from robust materials to withstand high pressure and temperature, then strength and durability are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The micropackage portions are pre-formed with integrated alignment features, positioning structures, and standardized bonding interfaces before attachment to the microsystem. This preliminary preparation of precise geometric features enables accurate alignment and attachment even when using robust materials that require high manufacturing precision, thereby achieving both strength and manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The packaged microsystems can survive high pressures and corrosive environments, maintaining functionality and communication capabilities while preventing corrosion and leakage, with the micropackage structure ensuring durability and efficient use of space.
Implementation Method 1
coated with alumina and poly(p-xylylene) for corrosion resistance
Implementation Method 2
at least one of the micropackage portions is configured to deform during step (b) to seal the microsystem in a cavity
Data Source
AI summary
A sub-millimeter packaged microsystem includes a microsystem located in a sealed cavity defined between first and second portions of a micropackage. One or both micropackage portions can be fabricated from a metal suitable for use in a harsh environment, such as an oil well environment. The microsystem includes electronic components and can be configured to communicate with external components through a wall of the micropackage by wireless communication or by conductive feedthroughs. Pluralities of microsystems, first micropackage portions, and/or second micropackage portions are simultaneously placed during a batch assembly process. The assembly process may include micro-crimping the first and second micropackaging portions together without the need for bonding materials and related process steps.