Microtextured Porous CMP Brush for Wafer Contaminant Removal

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Solution Overview

Problem

Conventional substrate-cleaning brushes are inefficient in removing contaminants from semiconductor wafers during post-chemical-mechanical planarization (CMP) due to lack of effective microtexturing and fluid delivery mechanisms, which affect cleaning efficiency and tribological interactions.

Innovation Solution

The development of brushes with microtextured contact surfaces and porous polymeric bodies that allow for fluid dispersion, mounted on rotatable bases with actuators, enabling enhanced lubrication, increased friction, and improved cleaning efficiency by incorporating microtextured nodules and channels for simultaneous chemical delivery.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional substrate-cleaning brushes are used, then the structure is simple, but cleaning efficiency is insufficient

Engineering Contradiction:
Improvecleaning efficiencyVSAvoidbrush structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The brush body is constructed from porous polymer material that allows cleaning fluids to penetrate and disperse through the brush structure, enabling effective delivery of chemicals to the substrate surface while maintaining structural integrity and cleaning efficiency

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The brush surface incorporates microtextured features with varying local properties including different nodule heights, spacing patterns, and surface roughness zones, creating localized areas optimized for different cleaning functions such as contaminant removal, fluid retention, and substrate contact

Inventive Principle:
Principle #3Local quality

2Reliability

If brushes without microtexturing are used, then manufacturing is simpler, but tribological interactions are insufficient

Engineering Contradiction:
Improvetribological interaction effectivenessVSAvoidbrush manufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The brush surface features arrays of spherical nodules with controlled diameters and height variations, creating curved micro-surfaces that enhance contact with the substrate, improve fluid distribution, and optimize tribological interactions through rolling and deformation mechanisms

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The microtextured nodules are pre-configured with specific height variations and spacing patterns during manufacturing to predetermined locations on the brush surface, ensuring optimal tribological performance and fluid delivery characteristics are established before the cleaning operation begins

Inventive Principle:
Principle #10Preliminary action

3Productivity

If brushes without fluid delivery mechanisms are used, then the structure is simpler, but cleaning effectiveness is reduced

Engineering Contradiction:
Improvecleaning effectivenessVSAvoidfluid delivery system complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The brush structure simultaneously performs multiple functions: mechanical cleaning through nodule contact, fluid delivery through porous material, chemical application through fluid channels, and substrate conditioning through controlled friction, all integrated into a single component

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The brush incorporates fluid delivery channels and porous polymer structure that utilize hydraulic principles to distribute cleaning fluids uniformly across the brush surface and onto the substrate, enabling controlled delivery of chemicals and water during the cleaning operation

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The microtextured brushes provide improved cleaning efficiency, enhanced lubrication, and increased friction, effectively removing contaminants from semiconductor wafers during CMP processes by utilizing microtextured surfaces and fluid dispersion mechanisms.

Implementation Method 1

porous polymeric bodies that allow for fluid dispersion

Methodology Applied
Scientific EffectFluid dispersion through porous material: Porosity

Implementation Method 2

microtextured contact surfaces... enhanced lubrication, and increased friction

Methodology Applied
Scientific EffectMicrotexturing effects on tribological interactions: Friction

Implementation Method 3

microtextured nodules and channels for simultaneous chemical delivery

Methodology Applied
Scientific EffectMechanical cleaning through microtextured contact: Abrasion

Implementation Method 4

porous polymeric brush body... channels for simultaneous chemical delivery

Methodology Applied
Scientific EffectChemical delivery through porous material: Absorption (physical)

Data Source

PatentUS20240112926A1Brushes, systems, and methods for post-CMP cleaning of a surface
Publication Date: 2024.04.04 ILLINOIS TOOL WORKS INC
  • US20240112926A1 patent drawing
  • US20240112926A1 patent drawing
  • US20240112926A1 patent drawing

AI summary

An example brush for cleaning of a substrate includes: a porous polymeric brush body having one or more contact surfaces for cleaning the substrate, the one or more contact surfaces comprising a microtexture; and a brush support configured to mechanically couple the brush body to an actuator.