Microwave Antenna Apparatus with Waveguide and Solid State Filling Material
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Solution Overview
Problem
Existing microwave antenna technologies suffer from narrow bandwidth, distorted radiation patterns, and high parasitic radiation in all directions, making them unsuitable for series production and efficient mm-wave communication systems.
Innovation Solution
A microwave antenna apparatus and package design featuring a redistribution layer with a carrier layer, microstrip line, semiconductor element, mold layer, and integrated waveguide with a solid-state filling material, which reduces parasitic radiation and enhances bandwidth by using a resonator unit and specific PCB arrangements to improve radiation patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If printed antenna structures are used on redistribution layers, then the antenna can be integrated into eWLB package, but the bandwidth is narrow (1-5%) and radiation patterns are distorted
Solution Approach 1:
The antenna system is segmented into multiple functional components: a planar antenna element for radiation, a waveguide structure for guided transmission, and a resonator unit for bandwidth enhancement. This segmentation allows each component to be optimized independently while working together to resolve the bandwidth and radiation pattern issues of conventional printed antennas
Solution Approach 2:
The patent employs composite structures combining different materials and transmission modes: planar conductive elements on substrate, dielectric materials for insulation, and waveguide structures with specific geometric configurations. This composite approach enables simultaneous achievement of integration, wide bandwidth, and proper radiation patterns
2Reliability
If printed waveguide structures are integrated to eWLB package, then guided transmission is achieved, but the mechanical interface is relatively complicated and not applicable for series product
Solution Approach 1:
The waveguide structure is merged with the planar antenna elements and substrate to form an integrated assembly. The waveguide openings are positioned to align with the antenna elements, creating a unified structure that eliminates separate mechanical interfaces and enables series production through conventional PCB and antenna manufacturing processes
Solution Approach 2:
The substrate serves as an intermediary that mechanically and electromagnetically couples the planar antenna elements to the waveguide structures. This intermediary approach simplifies the interface by using the existing substrate as the coupling medium rather than requiring additional mechanical components
3Ease of manufacture
If conventional printed antenna structures are used, then manufacturing is simple, but parasitic radiation to all directions is high
Solution Approach 1:
The harmful parasitic radiation is extracted and redirected into the waveguide structures. The waveguide openings are positioned to capture parasitic radiation that would otherwise propagate in unwanted directions, converting it into guided transmission modes that can be usefully utilized
Solution Approach 2:
The patent converts the harmful parasitic radiation into a beneficial resource by using the waveguide structures to capture and guide this energy. The parasitic radiation that would normally represent energy loss is instead channeled through the waveguides to contribute to the desired transmission, improving overall system efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a wider bandwidth, reduced parasitic radiation, and improved radiation patterns, enabling efficient integration into mm-wave communication systems without the need for external antennas, suitable for series production and guided transmission.
Implementation Method 1
a waveguide arranged within the mold layer and on the first surface of the carrier layer and coupled to the semiconductor element by the microstrip line, wherein a solid state filling material is arranged within the waveguide
Implementation Method 2
a resonator unit arranged within the mold layer and on the first surface of the carrier layer, wherein the resonator unit comprises a substrate element, in particular made of quartz glass, PTFE, LCP or ceramic, coupled to the microstrip line and a resonator element mounted on a surface of the substrate element
Data Source
AI summary
A microwave antenna apparatus includes: a redistribution layer including a carrier layer, a ground plane arranged on a first or second surface of the carrier layer, and a microstrip line arranged on the other one of the first or second surface of the carrier layer; a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line; a mold layer that covers the semiconductor element and the first surface of the carrier layer; and a waveguide arranged within the mold layer and on the first surface of the carrier layer and coupled to the semiconductor element by the microstrip line, wherein a solid state filling material is arranged within the waveguide. Further, integrated antennas and transitions are presented within eWLB packages.