Multi-layer Microwave Circuit with Heat Substrate Projection
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Solution Overview
Problem
Existing micro and millimeter waves circuits are limited to single-layer conductor designs, preventing large-scale circuit implementations due to the lack of multiple conductor layers, which restricts the complexity and capacity of circuit board wiring.
Innovation Solution
A micro and millimeter waves circuit with a multi-layer circuit board, a heat substrate, and a circuit module, where the heat substrate has a projecting part that supports the circuit module, allowing for electrical connection with the outer conductor layer and enabling multiple conductor layers, thereby facilitating large-scale circuit design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-layer conductor circuit board is used, then the structure is simple and easy to manufacture, but large-scale circuit design cannot be implemented due to limited wiring capacity
Solution Approach 1:
The patent transitions from a single-layer conductor structure to a multi-layer conductor structure by adding vertical dimension (multiple layers stacked). This allows circuits to be routed on multiple planes, dramatically increasing wiring capacity and enabling large-scale circuit designs while maintaining manufacturing feasibility through standardized multi-layer PCB processes.
Solution Approach 2:
The circuit board is divided into multiple conductor layers separated by insulating layers. Each layer can be independently designed and routed, allowing complex circuits to be segmented across multiple planes. This segmentation enables large-scale circuit implementation by distributing wiring across multiple manageable layers.
2Adaptability or versatility
If multiple conductor layers are added to enable large-scale circuit design, then wiring capacity increases, but the structure becomes more complex
Solution Approach 1:
The heat substrate is designed to serve multiple functions simultaneously: it acts as the reference ground plane for RF signals, provides thermal management for the circuit module, and serves as a mechanical support structure. This multi-functionality reduces the need for additional separate components, thereby managing overall structural complexity despite having multiple conductor layers.
Solution Approach 2:
The patent merges the reference ground function with the heat substrate into a single integrated structure. The heat substrate itself becomes the reference ground plane, eliminating the need for separate ground layers in some cases. This merging reduces the number of discrete components and simplifies the overall structure while still enabling multi-layer conductor designs.
3Temperature
If the heat substrate serves as the reference ground, then thermal conduction is effective, but electrical isolation and multi-layer conductor configuration become difficult
Solution Approach 1:
The structure is segmented into distinct functional zones: the heat substrate provides thermal conduction and serves as reference ground, while separate insulating layers and conductor patterns provide electrical isolation where needed. This segmentation allows simultaneous achievement of thermal conduction and electrical isolation by assigning different functions to different structural elements.
Solution Approach 2:
Insulating layers are introduced as intermediary elements between the heat substrate (reference ground) and other conductor layers. These intermediary layers provide electrical isolation while allowing thermal conduction to proceed through the heat substrate. The insulating layers mediate between the conflicting requirements of electrical isolation and thermal conduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the implementation of large-scale circuit designs by allowing multiple conductor layers, increasing wiring capacity and supporting complex circuit board configurations, while maintaining effective heat and electrical conduction.
Implementation Method 1
The bare chip is adhered on the heat substrate through electrical conduction materials such as silver paste, so that good heat conduction and electrical conduction connection exists between the bare chip and the heat substrate
Implementation Method 2
The bare chip is adhered on the heat substrate through electrical conduction materials such as silver paste, so that good heat conduction and electrical conduction connection exists between the bare chip and the heat substrate
Data Source
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AI summary
Embodiments of the present invention provide a micro and millimeter waves circuit, including: a multi-layer circuit board, a heat substrate, and a circuit module. The multi-layer circuit board is opened with a window. The heat substrate includes a base. The multi-layer circuit board is attached to the base. The heat substrate further includes a projecting part extending from the base into the window of the multi-layer circuit board. The circuit module is received in the window and placed on the projecting part. The circuit module is electrically connected with an outer conductor layer of the multi-layer circuit board.