Microwave Sensing of Coated Blade Edges for Automated Chamfering
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Solution Overview
Problem
Existing methods for detecting substrate edges under dielectric coatings are inefficient and require manual intervention, hindering the automation of chamfering processes.
Innovation Solution
A substrate edge detection system using a probe that emits scanning signals capable of passing through dielectric coatings and reflecting off the substrate material, combined with a controller for precise edge localization and adaptive machining, enabling automated edge detection and machining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual methods are used to detect substrate edges under dielectric coatings, then the detection can be performed, but the process is time-consuming and requires manual intervention
Solution Approach 1:
The patent replaces manual mechanical inspection methods with an automated electromagnetic sensing system. The probe emits electromagnetic signals that penetrate the dielectric coating and detect substrate edges through signal reflection changes, eliminating the need for manual visual inspection and significantly improving detection speed while maintaining accuracy.
Solution Approach 2:
The patent introduces electromagnetic signals as an intermediary to detect the substrate edge position indirectly. The signals pass through the dielectric coating and interact with the substrate, allowing detection of the edge position without direct mechanical contact or visual access, thus enabling automated detection under coatings.
2Productivity
If automated machining is implemented without accurate edge detection, then productivity increases, but the substrate material may be damaged
Solution Approach 1:
The patent implements a feedback mechanism where the probe continuously detects substrate edge positions during the machining process. The detected position information is fed back to control the machining tool, ensuring that chamfering operations are performed only on the coating material and stop precisely at the substrate edge, preventing substrate damage while enabling automation.
Solution Approach 2:
The patent performs preliminary detection of the substrate edge position before machining begins. This advance knowledge of the exact edge location allows the automated machining system to plan its toolpath to avoid the substrate, ensuring substrate integrity from the start of the automated process.
3Device complexity
If optical methods are used to detect substrate edges, then the detection is simple, but it fails when edges are hidden by opaque coatings
Solution Approach 1:
The patent changes the detection parameter from optical (visible light) to electromagnetic (radio frequency signals). This parameter change allows the detection system to penetrate dielectric coatings that are opaque to visible light, enabling detection of substrate edges under coatings while maintaining relatively simple device complexity through the use of standard electromagnetic sensing technology.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables automated and precise detection of substrate edges under dielectric coatings, facilitating efficient and automated chamfering processes without damaging the substrate.
Implementation Method 1
the probe is configured to emit microwave frequency scanning signals that can pass through the coating and be reflected by the substrate material
Implementation Method 2
emitting a scanning signal that can pass through the coating and be reflected by the substrate material
Data Source
AI summary
A substrate edge detection system including a substrate material having the substrate edge with a surface; a coating disposed on the surface of the substrate edge; a probe in operative communication with the coating and the substrate edge; and a controller in operative communication with the probe.