Microwave Connector With Dissipative Dielectric Filtering
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Solution Overview
Problem
High-frequency coaxial lines at cryogenic temperatures face challenges in proper filtering of unwanted frequencies and optimal thermalization, particularly due to the use of excellent thermal insulators as dielectric materials, which can lead to signal loss and noise issues.
Innovation Solution
A microwave connector design featuring an outer conductor, an inner conductor with specific portions, and a combination of non-dissipative and dissipative dielectric materials to achieve efficient thermalization and filtering, allowing for impedance matching and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If excellent thermal insulators are used as dielectric materials in coaxial lines at cryogenic temperatures, then thermal isolation is improved, but thermalization of the inner conductor deteriorates
Solution Approach 1:
The patent applies different dielectric materials with different thermal properties to different regions of the coaxial line. Specifically, the dielectric material has a thermal conductivity that varies along the length of the inner conductor, with higher thermal conductivity regions positioned at thermal anchoring points to enhance heat transfer from the inner conductor to the outer conductor, while maintaining low thermal conductivity in other regions for thermal isolation.
Solution Approach 2:
The patent employs composite dielectric structures combining materials with different thermal conductivities. The dielectric may consist of multiple layers or regions with varying thermal properties, allowing simultaneous achievement of thermal isolation in non-anchoring regions and effective thermalization at anchoring points where higher thermal conductivity materials are strategically placed.
2Object-affected harmful factors
If filtering components are added to remove out-of-band radiation, then filtering performance is improved, but device complexity increases
Solution Approach 1:
The patent designs the dielectric structure to serve multiple functions simultaneously: it provides thermal isolation, enables thermalization at anchoring points, and acts as a filtering mechanism for out-of-band radiation. By integrating these functions into a single multi-functional component rather than adding separate filtering devices, the overall device complexity is reduced while maintaining effective filtering performance.
3Reliability
If impedance matching components are added to minimize reflections, then signal integrity is improved, but device complexity increases
Solution Approach 1:
The patent implements impedance matching through local variations in the dielectric structure rather than through separate matching components. By strategically positioning regions with different thermal and electrical properties within the dielectric material, the patent achieves both thermal management and impedance matching functions through the same structural modifications, avoiding additional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The connector effectively filters out-of-band radiation, minimizes signal reflections, and provides optimal thermalization, maintaining signal integrity and coherence times in superconducting qubits at millikelvin temperatures.
Implementation Method 1
a dissipative dielectric material disposed to surround the third portion of the inner conductor
Implementation Method 2
the dielectric separating outer and inner conductors is typically an excellent thermal insulator
Data Source
AI summary
A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material.