3D Injection-Molded Microwave Contacts for Dense Radar Routing
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Solution Overview
Problem
The increasing complexity and packing density of modern microwave apparatus, particularly in radar systems, pose challenges in signal routing due to the need to combine different material layers and technologies, leading to difficulties in achieving low-loss, compact, and versatile signal distribution networks while maintaining cost-effectiveness and angular resolution.
Innovation Solution
A hybrid apparatus using a 3-dimensional injection molded layer with deformable microstructures and an electrically isolating bonding agent to establish a robust and flexible connection between metal and injection molded layers, allowing for efficient signal distribution and routing in radar systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different material layers (microstrip and waveguide) are combined in hybrid solutions, then signal distribution versatility is improved, but device complexity and routing difficulty increase
Solution Approach 1:
The patent combines microstrip and waveguide technologies into a single hybrid apparatus, integrating different signal transmission media to achieve versatile signal distribution while reducing the number of separate components needed
Solution Approach 2:
The hybrid apparatus is designed to handle multiple signal routing functions within a single structure, supporting both microstrip and waveguide signal paths, thereby reducing overall system complexity despite the multi-functional capability
2Volume of moving object
If packing density of antenna elements and signal lines is increased, then apparatus size is reduced, but signal routing difficulty and collision avoidance become more challenging
Solution Approach 1:
The patent utilizes three-dimensional integration with injection molded layers to route signals in multiple spatial dimensions, allowing high-density packing of antenna elements and signal lines while maintaining collision-free routing through vertical and lateral path planning
3Measurement precision
If channel count is increased for higher angular resolution, then measurement precision is improved, but signal routing complexity and collision-free path finding increase
Solution Approach 1:
The patent segments the signal routing into multiple independent layers (PCB layer, injection molded layer, metal layer), allowing each layer to handle specific signal paths without interference, thereby supporting high channel counts for improved angular resolution while maintaining manageable routing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a reliable, low-loss, and compact signal distribution network with reduced part count, facilitating accurate alignment and robust fixation, thereby addressing the challenges of signal routing and cost in high-density microwave systems.
Implementation Method 1
a plurality of deformable microstructures serving as electric pressure contacts when assembling said first contact partner and said second contact partner
Implementation Method 2
deformable microstructures serving as electric pressure contacts
Implementation Method 3
an electrically isolating bonding agent being situated between said first contact partner and said second contact partner
Data Source
AI summary
An apparatus at least comprising a first contact partner which has a first metal contact surface, a 3-dimensional injection molded layer serving as second contact partner which has a second metal contact surface, and which comprises a synthetic injection-moldable material, and a plurality of deformable microstructures being situated between said first contact partner and said second contact partner. Said deformable microstructures are serving as electric pressure contacts which electrically connect said first metal contact surface and said second metal contact surface after having assembled said first contact partner and said second contact partner. Said apparatus comprises an electrically isolating bonding agent, preferably an electrically isolating bonding agent comprising a polymeric material or a polymeric-based compound material. Said bonding agent being situated between said first contact partner and said second contact partner.